LED Heat Dissipation Analysis Using Composite Based Cylindrical Slug
LED Heat Dissipation Analysis Using Composite Based Cylindrical Slug
复制标题
使用基于复合材料的圆柱形插塞进行 LED 散热分析
DOI：
10.4028/www.scientific.net/amr.893.803
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发表时间：
2014
期刊：
影响因子：
--
通讯作者：
V. Retnasamy
中科院分区：
文献类型：
--
作者：
Z. Sauli;R. Vairavan;V. Retnasamy
发光二极管的光学功效和可靠性很大程度上受到LED的工作结温的影响。因此，结温的评估具有重要意义。本文报道了基于铜金刚石（Cu/Dia）圆柱形散热片的单芯片LED封装的散热仿真分析。采用Ansys版本11作为仿真平台。在自然对流条件下，评估了 LED 芯片在 0.1 W、0.5 W 和 1 W 不同输入功率下的结温和应力。结果表明，在输入功率为 1 W 时，LED 芯片达到了最高结温。
The optical efficacy and reliability of light emitting diode is extensively influenced by the operating junction temperature of the LED. Therefore, the evaluation of junction temperature is significant. This paper reports a simulation analysis on the heat dissipation of single chip LED package with based material, copper diamond (Cu/Dia) cylindrical heat slug.Ansys version 11 was utilized as the simulation platform. The junction temperature and stress of the LED chip under natural convection condition were evaluated with varied input power of 0.1 W, 0.5 W and 1 W. Results indicated the maximum junction temperature of LED chip was attained at input power of 1 W.