Heating Effect on Photoresist in Spray Coating Technique for Three-Dimensional Lithography
Heating Effect on Photoresist in Spray Coating Technique for Three-Dimensional Lithography
复制标题
三维光刻喷涂技术中光刻胶的加热效应
DOI：
10.1143/jjap.42.4027
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发表时间：
2003
影响因子：
1.5
通讯作者：
K. Hane
中科院分区：
文献类型：
--
作者：
V. Singh;M. Sasaki;J. Song;K. Hane
光致抗蚀剂的喷涂是用于在微机电系统领域中经常需要的三维结构上实现光刻的有前途的技术。揭示工艺性能，确定最佳工艺条件，是保证工艺可靠性的必要条件。研究了在各向异性湿法刻蚀深腔上获得均匀抗蚀剂厚度所需的条件。样品温度和加热样品所需的功率密度被发现有显着的效果。在优化的条件下，在腔体上获得均匀的抗蚀剂膜（顶部、倾斜和底部平坦区域的平均厚度为1.5 μm，凸角和凹角的平均厚度分别为2.4和2.7 μm）。
Spray coating of the photoresist is a promising technique for realizing photolithography on three-dimensional structures, which is frequently desired in the field of microelectromechanical systems. Revealing the technical performance and determining the optimum conditions are indispensable for making the process reliable. The conditions required for obtaining a uniform resist thickness over the anisotropically wet etched deep cavity are examined. The sample temperature and the power density required for heating the sample are found to have a significant effect. At the optimized conditions, a uniform resist film is obtained over the cavity (with an average thickness of 1.5 µm on the top, slanting, and bottom flat regions, and 2.4 and 2.7 µm on the convex and concave corners, respectively).