Experimental investigation of surface/subsurface damage formation and material removal mechanisms in SiC grinding
Experimental investigation of surface/subsurface damage formation and material removal mechanisms in SiC grinding
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DOI：
10.1016/j.ijmachtools.2007.10.013
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发表时间：
2008-05-01
影响因子：
14
通讯作者：
Rao, P. Venkateswara
中科院分区：
文献类型：
--
作者：
Agarwal, Sanjay;Rao, P. Venkateswara
硬脆陶瓷的研磨加工的难度和成本是当今先进陶瓷在工业中广泛使用的主要障碍之一。通常期望在保持期望的表面完整性的同时提高加工速率。然而，这种方法的成功依赖于对微观结构尺度上的材料去除机制的理解以及磨削特性与表面/亚表面加工引起的损伤的形成之间的关系。本文研究了平面磨床上金刚石砂轮磨削碳化硅的磨削特性、表面完整性和材料去除机理。用扫描电子显微镜（SEM）研究了表面和亚表面的损伤。讨论了磨削条件对表面/亚表面损伤的影响。这项研究链接的表面粗糙度，表面和亚表面损伤的磨削参数，并提供了有价值的见解的材料去除机制和磨削引起的损伤对磨削条件的依赖性。(C)2007爱思唯尔有限公司保留所有权利。
The difficulty and cost involved in the abrasive machining of hard and brittle ceramics are among the major impediments to the widespread use of advanced ceramics in industries these days. It is often desired to increase the machining rate while maintaining the desired surface integrity. The success of this approach, however, relies in the understanding of mechanism of material removal on the microstructural scale and the relationship between the grinding characteristics and formation of surface/subsurface machining-induced damage. In this paper, grinding characteristics, surface integrity and material removal mechanisms of SiC ground with diamond wheel on surface grinding machine have been investigated. The surface and subsurface damages have been studied with scanning electron microscope (SEM). The effects of grinding conditions on surface/subsurface damage have been discussed. This research links the surface roughness, surface and subsurface damages to grinding parameters and provides valuable insights into the material removal mechanism and the dependence of grinding-induced damage on grinding conditions. (C) 2007 Elsevier Ltd. All rights reserved.