Surface-specific additive manufacturing test artefacts

Surface-specific additive manufacturing test artefacts
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特定表面增材制造测试制品

DOI:
10.1088/2051-672x/aabcaf
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发表时间:
2018
期刊:
Surface Topography: Metrology and Properties
影响因子:
--
通讯作者:
L. Blunt
L. Blunt
中科院分区:
--
文献类型:
--
作者:
A. Townsend;R. Racasan;L. Blunt

文献摘要

被引文献

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许多测试制品设计已被提议与增材制造 (AM) 系统一起使用。这些测试制品主要是为了评估增材制造形状和尺寸性能而设计的。本文提出了一系列专为验证增材制造制造工艺而设计的特定表面测量测试制品。特定于表面的测试制品可以变得更加紧凑,因为它们不需要精确尺寸和形状测量所需的大尺寸。该系列的三个测试制品旨在提供有关制造表面的全面信息。测量可能性包括偏差分析、表面纹理参数数据生成、次表面分析、层阶分析和构建分辨率比较。测试制品旨在使用传统表面测量技术(例如焦点变化显微镜、触针轮廓测定法、共焦显微镜和扫描电子显微镜)轻松进行测量。此外,测试制品可以作为比较工具进行简单的目视检查,从而快速指示构建之间的过程变化。这三个测试工件足够小,可以包含在每个构建中,并包含内置的制造可追溯性信息,使它们成为构建的便捷物理记录。
Many test artefact designs have been proposed for use with additive manufacturing (AM) systems. These test artefacts have primarily been designed for the evaluation of AM form and dimensional performance. A series of surface-specific measurement test artefacts designed for use in the verification of AM manufacturing processes are proposed here. Surface-specific test artefacts can be made more compact because they do not require the large dimensions needed for accurate dimensional and form measurements. The series of three test artefacts are designed to provide comprehensive information pertaining to the manufactured surface. Measurement possibilities include deviation analysis, surface texture parameter data generation, sub-surface analysis, layer step analysis and build resolution comparison. The test artefacts are designed to provide easy access for measurement using conventional surface measurement techniques, for example, focus variation microscopy, stylus profilometry, confocal microscopy and scanning electron microscopy. Additionally, the test artefacts may be simply visually inspected as a comparative tool, giving a fast indication of process variation between builds. The three test artefacts are small enough to be included in every build and include built-in manufacturing traceability information, making them a convenient physical record of the build.