In-situ electron backscatter diffraction of thermal cycling in a single grain Cu/Sn-3Ag-0.5Cu/Cu solder joint
In-situ electron backscatter diffraction of thermal cycling in a single grain Cu/Sn-3Ag-0.5Cu/Cu solder joint
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DOI：
10.1016/j.scriptamat.2019.09.003
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发表时间：
2019-07
影响因子：
6
通讯作者：
Tianhong Gu;Yilun Xu;C. M. Gourlay;T. Ben Britton
中科院分区：
文献类型：
--
作者：
Tianhong Gu;Yilun Xu;C. M. Gourlay;T. Ben Britton
采用原位热循环结合电子背散射衍射（EBSD）技术研究了单晶粒Cu/SAC 305/Cu焊点组织的不均匀演化。由于热膨胀不匹配导致的局部变形导致接头内的异质晶格旋转，朝向拐角局部化。这种变形是由β-Sn、Cu 6Sn 5和Cu在界面处的约束和热膨胀系数（CTE）失配引起的。在变形过程中，亚晶的形成伴随着取向差的持续增加，这意味着在应变局部化区域塑性滑移的积累以及滑移系（110）[11]/2和（0）[111]/2的激活。
The heterogeneous evolution of microstructure in a single grain Cu/SAC305/Cu solder joint is investigated using in-situ thermal cycling combined with electron backscatter diffraction (EBSD). Local deformation due to thermal expansion mismatch results in heterogeneous lattice rotation within the joint, localised towards the corners. This deformation is induced by the constraint and the coefficient of thermal expansion (CTE) mismatch between the β-Sn, Cu6Sn5and Cu at interfaces. The formation of subgrains with continuous increase in misorientation is revealed during deformation, implying the accumulation of plastic slip at the strain-localised regions and the activation of slip systems (110)[11]/2 and (0)[111]/2.