Design and fabrication of a transmitter optical subassembly (TOSA) in 10-gb/s small-form-factor pluggable (XFP) transceiver
Design and fabrication of a transmitter optical subassembly (TOSA) in 10-gb/s small-form-factor pluggable (XFP) transceiver
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DOI：
10.1109/jstqe.2006.876184
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发表时间：
2006-08
影响因子：
4.9
通讯作者：
Dongchurl Kim;J. Shim;Y. Keh;Munkyu Park
中科院分区：
文献类型：
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作者：
Dongchurl Kim;J. Shim;Y. Keh;Munkyu Park
针对10 Gb/s小型可插拔（XFP）收发器模块的电性能和热性能，设计了一种智能紧凑型封装发射光学子组件（TOSA）。在TOSA中，偏置T形电路和匹配电阻单片集成在具有高热导率的AlN基板上，并且在晶体管轮廓（TO）干中绘制了新提出的共面波导。为了提高TOSA的电性能，引入并利用TOSA中所有光电器件的等效电路模型。在85 ℃高温下传输75 km后，器件的-3 dB带宽高达11 GHz，损耗为0.36 dB
A smart and compact packaging transmitter optical subassembly (TOSA) in a 10-Gb/s small-form-factor pluggable (XFP) transceiver module has been developed with an eye towards electrical and thermal performances. In the TOSA, a bias-tee circuit and a matching resistor are monolithically integrated on an AlN submount with high thermal conductivity, and a newly proposed coplanar waveguide is drawn in a transistor outline (TO)-stem. In order to improve the electrical performance of the TOSA, the equivalent circuit model of all optoelectronic components in the TOSA is introduced and utilized. The fabricated TOSA shows the -3-dB bandwidth as high as 11 GHz and 0.36-dB penalty after a 75-km transmission at an elevated temperature of 85degC