Inductive and Capacitive Coupling Noise in Superconductive VLSI Circuits
Inductive and Capacitive Coupling Noise in Superconductive VLSI Circuits
复制标题
超导 VLSI 电路中的电感和电容耦合噪声
DOI：
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发表时间：
2023
影响因子：
1.8
通讯作者：
Eby G. Friedman
中科院分区：
文献类型：
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作者：
T. Jabbari;Eby G. Friedman
随着现代MEMS电路，特别是单通量量子（SFQ）电路的复杂性的增加，耦合噪声的问题变得越来越重要。有限的金属资源内的可再生能源电路加剧了这个问题。在这篇文章中，SFQ电路中的耦合噪声的不同来源进行了描述。SFQ电路中电感、路由带状线和偏置微带线之间的耦合噪声降低性能，同时降低裕度。在这篇文章中，不同层之间的电感和电容耦合的特点。MIT LL SFQ5ee工艺中不同层之间的电感耦合模型与实验数据的匹配度在3%以内。电感耦合的氧化物和金属层的厚度上的依赖关系也进行了讨论。了解电感和电容耦合可以确定线路之间的最小物理距离。此外，在电感耦合、电容耦合、布局复杂性和接地层之间的通孔之间存在折衷。不同的耦合源的特点，并提供指导方针，以提高自动布线过程。
The increasing complexity of modern superconductive circuits, and single flux quantum (SFQ) circuits in particular, has made the issue of coupling noise of growing importance. Limited metal resources within superconductive circuits have exacerbated this issue. In this article, the different sources of coupling noise within SFQ circuits are described. Coupling noise among inductors, routing striplines, and bias microstriplines within SFQ circuits degrade performance while decreasing margins. In this article, inductive and capacitive coupling between the different layers are characterized. Inductive coupling models between different layers in the MIT LL SFQ5ee process match experimental data within 3%. The dependence of inductive coupling on the thickness of the oxide and metal layer is also discussed. An understanding of inductive and capacitive coupling can determine the minimum physical distance between lines. In addition, tradeoffs exist among inductive coupling, capacitive coupling, layout complexity, and the vias between ground layers. The different coupling sources are characterized, and guidelines are provided to enhance the automated routing process.