Properties of Oriented Strand Boards with External Layers made of Non-Strand Chips

Properties of Oriented Strand Boards with External Layers made of Non-Strand Chips
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DOI:
10.15376/biores.11.4.8344-8354
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发表时间:
2016-08
期刊:
影响因子:
1.5
通讯作者:
R. Mirski;D. Dziurka;A. Derkowski
R. Mirski;D. Dziurka;A. Derkowski
中科院分区:
材料科学4区
文献类型:
--
作者:
R. Mirski;D. Dziurka;A. Derkowski

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这项研究评估了用非原丝切片生产定向刨花板的可能性。所生产的电路板的性能与商用的OSB/3进行了比较。研究表明,用较小的芯片取代外层的线片可以使用比标准线片短四倍的芯片来制造OSB/3。定向刨花板制造商应该考虑制定新的标准,并向市场推出一种新型的OSB,这种新型的OSB具有非常好的机械性能,由精选的原片制成,其中包括筛选过程中获得的一种组分。
This study evaluated the possibility of producing oriented strand boards (OSB) from non-strand chips. Properties of the produced boards were compared with commercially available OSB/3. Research has shown that replacing the strand chips of external layers with smaller chips allowed for the manufacturing of OSB/3 using chips up to four times shorter than standard strand chips. Oriented strand board manufacturers should consider preparing a new standard and introducing the market to a new type of OSB with very good mechanical properties and made of selected strand chips comprising one of the fractions obtained during screening.