Mixed signal portable wireless packaging design and test challenges

Mixed signal portable wireless packaging design and test challenges
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混合信号便携式无线封装设计和测试挑战

DOI:
10.1109/iwv.1998.667124
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发表时间:
1998
期刊:
Proceedings IEEE Computer Society Workshop on VLSI'98 System Level Design (Cat. No.98EX158)
影响因子:
--
通讯作者:
S. Pannala
S. Pannala
中科院分区:
--
文献类型:
--
作者:
M. Swaminathan;S. Pannala

文献摘要

被引文献

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具有工作在千兆赫兹范围内的混合信号电路的无线通信系统的运行提高了对新的测试和设计方法的需求,以满足当前和未来的市场需求。本文讨论了混合信号便携式无线封装面临的挑战,重点讨论了设计和测试。还讨论了中国正在寻求的解决方案。
Operation of wireless communication systems with mixed signal circuits operating in gigahertz range frequencies has raised the need for new test and design methodologies to meet the current and future market requirements. This paper discusses the challenges arising in mixed signal portable wireless packaging with emphasis on design and test. Solutions being pursued at PRC are also discussed.