Enhanced thermal conductivity of multilayered sheets of polyethylene and boron nitride via promoting molecular diffusion between layers
Enhanced thermal conductivity of multilayered sheets of polyethylene and boron nitride via promoting molecular diffusion between layers
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通过促进层间分子扩散增强聚乙烯和氮化硼多层片材的导热性
DOI：
10.1063/1.5093686
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发表时间：
2019
影响因子：
3.2
通讯作者：
Li Zhong Ming
中科院分区：
文献类型：
--
作者：
Shi Ai;Li Yue;Liu Wei;Lei Jun;Xu Ling;Li Zhong Ming
在这项工作中，我们交替压缩高密度聚乙烯/低分子量聚乙烯（LMWPE）/六方氮化硼（h-BN）复合层和低密度聚乙烯层在一起，制造导热散装产品。与我们以前的工作（没有LMWPE组分）相比，引入短链组分，即，LMWPE的加入进一步提高了h-BN含量至18.3体积%，因此，退火后可以形成更多的导热路径，从而导致更高的导热性能。此外，在这项工作中，退火的多层立方体表现出1.96（W/m K）的高热导率，比我们以前的研究（1.37 W/m K）高43%。与具有随机分布的h-BN的样品相比，在相同的负载量下，实现了约145%的增强。结果表明，我们的方法来制作多层长方体有很大的机会，在电子器件的热管理领域的应用。
In this work, we alternatively compressed a high density polyethylene/low molecular weight polyethylene (LMWPE)/hexagonal boron nitride (h-BN) composite layer and a low density polyethylene layer together to fabricate thermally conductive bulk products. Compared to our previous work (without the LMWPE component), introducing the short chain component, i.e., LMWPE, into the composite layers further enhanced the h-BN content to 18.3 vol. %, and, thus, more thermally conductive paths could be formed after annealing, resulting in higher thermal conduction performance. Also, the annealed multilayered cuboid in this work exhibited a high thermal conductivity of 1.96 (W/m K), 43% higher than that of our previous study (1.37 W/m K). In contrast with that of the samples with randomly distributed h-BN at the same loading, an approximately 145% enhancement was achieved. The results demonstrate that our method to fabricate the multilayered cuboids has a great opportunity for application in the thermal management field of electric devices.