Verification of 2-D MEMS model using optical profiling techniques
Verification of 2-D MEMS model using optical profiling techniques
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DOI：
10.1016/s0143-8166(01)00036-7
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发表时间：
2001-08-01
影响因子：
4.6
通讯作者：
Lane, WA
中科院分区：
文献类型：
--
作者：
Hill, M;O'Mahony, C;Lane, WA
本文描述了扫描白光干涉测量法在单层和多层表面微机械加工中的应用。微机械元件。测量的轮廓数据用于验证压力和静电力下器件偏转的二维有限差分模型。建模的设备包括压力传感器。开关和过程表征结构。该模型旨在包含非刚性结构支撑和结构应力梯度等效应。光学分析用于量化这些效应产生的重要性和偏转形状。光学分析与 AFM 分析进行了比较，并对这些方法进行了一些比较。 (C) 2001 Elsevier Science Ltd. 保留所有权利。
This paper describes the application or scanning white light interferometry to profile single layer and multilayer, surface micromachined. micromechanical elements. The measured profile data is used to verify a 2-D finite difference model of device deflection under pressure and electrostatic forces. Devices modelled include pressure sensors. switches and process characterisation structures. The model is designed to include effects such as non-rigid structure supports and stress gradients through the structure. The optical profiling is used to quantify the significance and deflection shape resulting from these effects. The optical profiling has been compared with the AFM profiling and some comparisons are made between these methods. (C) 2001 Elsevier Science Ltd. All rights reserved.