Nanoporous metal (Cu, Ag, Au) films with high surface area: General fabrication and preliminary electrochemical performance
Nanoporous metal (Cu, Ag, Au) films with high surface area: General fabrication and preliminary electrochemical performance
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DOI：
10.1021/jp071815y
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发表时间：
2007-06-21
影响因子：
3.7
通讯作者：
Zhang, Lizhi
中科院分区：
文献类型：
--
作者：
Jia, Falong;Yu, Chuanfang;Zhang, Lizhi
采用常规的合金化/去合金化工艺在相应的金属基底上直接制备了铜、银和金的纳米多孔薄膜。该过程涉及锌在金属表面上的电沉积、热合金化和锌的化学去合金化。在工业镀锌液中，室温下实现了金属基体上锌的电沉积。然后在氮气中在相对低的温度（低于150摄氏度）下通过热处理形成表面锌金属合金。通过将合金浸入蚀刻溶液中，我们通过从合金中化学溶解Zn来获得金属NPF。表征结果表明，沉积锌层厚度和热合金化温度对产物的形貌和多孔结构有很大影响。此外，初步测试表明，所制备的金NPF具有比抛光一个更高的表面积。此外，Au NPF可以作为一个纳米多孔骨架，用于制造Pt涂覆的Au NPF电极。当使用所得Pt涂覆的Au NPF复合电极代替抛光的Pt电极时，葡萄糖的氧化电流提高约180倍。本研究提供了一种在相应的金属基底上直接制备纳米多孔金属薄膜的一般方法。
Nanoporous films (NPFs) of copper, silver, and gold were directly fabricated on the corresponding metal substrates by a general alloying/dealloying process. This process involved the electrodeposition of Zn on metal surfaces, thermal alloying, and chemical dealloying of Zn. Electrodeposition of Zn on metal substrates was realized in commercial Zn plating electrolyte at room temperature. Then surface zinc-metal alloys were formed by thermal treatment at relatively low temperatures (below 150 degrees C) in nitrogen gas. By immersing the alloys in etching solutions, we obtained metal NPFs through chemical dissolution of Zn from the alloys. Characterization results showed that the morphologies and porous structures of the products were greatly affected by the thickness of the deposited Zn layer and thermal alloying temperature. Moreover, preliminary testing showed that the as-prepared gold NPF possessed a higher surface area than the polish one. Furthermore, the Au NPF could serve as a nanoporous skeleton for fabricating Pt-coated a Au NPF electrode. The oxidation current of glucose was improved about 180 times when using the resulting Pt-coated Au NPF composite electrode instead of the polished Pt electrode. This study provides a general method to directly fabricate nanoporous metal films on the corresponding metal substrates.