Powder LSI: an ultra small RF identification chip for individual recognition applications
Powder LSI: an ultra small RF identification chip for individual recognition applications
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Powder LSI：用于个人识别应用的超小型射频识别芯片
DOI：
10.1109/isscc.2003.1234354
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发表时间：
2003
期刊：
影响因子：
--
通讯作者：
Ryo Imura
中科院分区：
文献类型：
--
作者：
M. Usami;Akira Sato;Kenji Sameshima;Kazuki Watanabe;Hiroshi Yoshigi;Ryo Imura
描述了一种用于无线识别应用的粉末状0.09 mm/sup 2/ 2.45 GHz射频识别芯片。该芯片采用0.18 /spl mu/m CMOS工艺制作，厚度为60 /spl mu/m。采用双面连接技术，方便天线的附着。当读写器功率为300mw时，芯片与读写器的距离为300mm。
A powder-like 0.09 mm/sup 2/ 2.45 GHz RF identification chip for wireless recognition applications is described. This chip is fabricated in a 0.18 /spl mu/m CMOS process, and its thickness is 60 /spl mu/m. A two-surface connection technique is adopted to facilitate antenna attachment. The distance between the chip and a reader is 300 mm for a reader power of 300 mW.