Surface oxidation of molten Sn(Ag, Ni, In, Cu) alloys
Surface oxidation of molten Sn(Ag, Ni, In, Cu) alloys
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DOI：
10.1007/s11837-009-0088-5
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发表时间：
2009-06
期刊：
影响因子：
2.6
通讯作者：
Y. Y. Lee-Y.;H. Tseng;Y. Hsiao;C. Y. Liu
中科院分区：
文献类型：
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作者：
Y. Y. Lee-Y.;H. Tseng;Y. Hsiao;C. Y. Liu
研究了Sn（Ag，Ni，In，Cu）合金熔体的表面氧化。结果表明，表面氧化层的微观结构（物相和致密度）是表面氧化形成的关键因素。此外，我们发现，锡表面氧化物层的微观结构（相和密度）的焊料合金中的添加剂，这可以大致从添加剂的电磁场值和氧化物形成的吉布斯自由能的影响。本文讨论了添加剂对表面氧化的具体影响（或缓或促）。
The surface oxidations of molten Sn(Ag, Ni, In, Cu) alloys are studied. We conclude that the microstructure (phase and density) of the surface oxide layer is the key factor for the surface oxidation formation. Also, we found that the microstructure (phase and density) of the Sn surface oxide layer is highly influenced by the additives in the solder alloys, which can be roughly anticipated from the additives’ electromagnetic field values and Gibbs free energies of oxide formation. The detailed effect (either retarding or enhancing) of the additives on the surface oxidation is discussed in this paper.