Influence of Ag Addition on J c and Mechanical Properties of Ag/Bi2223 Tapes
Influence of Ag Addition on J c and Mechanical Properties of Ag/Bi2223 Tapes
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Ag添加量对Ag/Bi2223带J c和力学性能的影响
DOI：
10.1007/978-4-431-68305-6_155
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发表时间：
1993
期刊：
影响因子：
--
通讯作者：
T. Maruyama
中科院分区：
文献类型：
--
作者：
K. Osamura;Shojiro Ochiai;T. Maruyama
小于几微米的细小分散的银颗粒提高了Ag护套Bi 2223带材的临界电流密度（Jc）。在4.2K的低磁场下，弱连接行为得到改善，Jc随Ag浓度的增加而增加，并在15wt%左右达到最大值。在10 T下记录的最高Jc约为60，000 A/cm 2，这比非添加剂试样的值大约8倍。从磁通钉扎和粒子在空间的不规则分布两个方面讨论了它对Jc的影响。断裂强度随Ag含量的增加而单调增加。银颗粒的存在导致了附加压应力的局部分布，使得断裂强度增加。
The fine dispersed silver particles less than a fewµm improved the critical current density (Jc) of Ag sheathed Bi2223 tapes. Under a low magnetic field at 4.2 K, the weak link behaviour was improved and the Jc increased with increaing Ag concentration and passed the maximum at about 15 wt %Ag. The highest Jc recorded about 60,000 A/cm2at 10 T, which is about 8 times larger than the value for the non-additive specimen. Its influence on Jc was discussed in terms of the flux pinning and the irregular distribution of particles in space. The fracture strength increases monotonically with increasing Ag concentration. The presence of silver particles was suggested to result in a local distribution of additional compressive stress, making the fracture strength increase.