A Systolic Neural CPU Processor Combining Deep Learning and General-Purpose Computing With Enhanced Data Locality and End-to-End Performance
A Systolic Neural CPU Processor Combining Deep Learning and General-Purpose Computing With Enhanced Data Locality and End-to-End Performance
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脉动神经 CPU 处理器将深度学习和通用计算与增强的数据局部性和端到端性能相结合
DOI:
10.1109/jssc.2022.3214170
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发表时间:
2023
影响因子:
5.4
通讯作者:
Gu, Jie
中科院分区:
文献类型:
--
作者:
Ju, Yuhao;Gu, Jie
While neural network (NN) accelerators are being significantly developed in recent years, CPU is still essential for data management and pre-/post-processing of accelerators in a commonly used heterogeneous architecture, which usually contains an NN accelerator and a processor core with data transfer performed by direct memory access (DMA) engine. This work presents a special neural processor, referred to as a systolic neural CPU processor (SNCPU), which is a unified architecture combining deep learning and general-purpose computing for fifth-generation of reduced instruction set computer (RISC-V) to improve end-to-end performance for machine learning (ML) tasks compared with a common heterogeneous architecture with CPU and accelerator. With 64%–80% processing elements (PEs) logic reuse and 10% area overhead, SNCPU can be configured into ten RISC-V CPU cores. Special bi-directional dataflow and four different working modes are developed to enhance the utilization of deep NN (DNN) accelerator and eliminate the expensive data transfer between CPU and DNN accelerator in existing heterogeneous architecture. A 65-nm test chip was fabricated demonstrating a 39%–64% performance improvement on end-to-end image classification tasks for ImageNet, Cifar10, and MNIST datasets with over 95% PE utilization and up to 1.8TOPs/W power efficiency.
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影响因子:
5.4
作者:
Jingcheng Wang;Xiaowei Wang;Charles Eckert;Arun K. Subramaniyan;R. Das;D. Blaauw;D. Sylvester
通讯作者:
Jingcheng Wang;Xiaowei Wang;Charles Eckert;Arun K. Subramaniyan;R. Das;D. Blaauw;D. Sylvester
DOI:
--
发表时间:
2020
期刊:
2020 IEEE Symposium on VLSI Circuits
影响因子:
--
作者:
I. Panades;Benoît Tain;J. Christmann;David Coriat;R. Lemaire;C. Jany;B. Martineau;F. Chaix;A. Quelen;Emmanuel Pluchart;J. Noel;R. Boumchedda;A. Makosiej;Maxime Montoya;Simone Bacles;David Briand;Jean;A. Valentian;Frédéric Heitzmann;E. Beigné;F. Clermidy
通讯作者:
F. Clermidy
DOI:
10.1109/isscc42614.2022.9731757
发表时间:
2022
期刊:
International Solid-State Circuit Conference
影响因子:
--
作者:
Ju, Yuhao;Gu, Jie
通讯作者:
Gu, Jie
DOI:
--
发表时间:
2021
期刊:
European Solid-State Circuits Conference
影响因子:
--
作者:
Angelo Garofalo;G. Ottavi;Alfio Di Mauro;Francesco Conti;Giuseppe Tagliavini;L. Benini;D. Rossi
通讯作者:
D. Rossi
DOI:
--
发表时间:
2022
期刊:
IEEE Custom Integrated Circuits Conference
影响因子:
--
作者:
H. Sumbul;Tony F. Wu;Yuecheng Li;Syed Shakib Sarwar;W. Koven;Eli Murphy;Xingxing Cai;E. Ansari;D. Morris;Huichu Liu;Doyun Kim;E. Beigné
通讯作者:
E. Beigné