Wetting interactions between the Ni-Cu-P deposit and In-Sn solders
Wetting interactions between the Ni-Cu-P deposit and In-Sn solders
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DOI：
10.1109/96.618218
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发表时间：
1997-08
期刊：
影响因子：
--
通讯作者：
Chun-Jen Chen;Kwang-Lung Lin
中科院分区：
文献类型：
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作者：
Chun-Jen Chen;Kwang-Lung Lin
利用扫描电镜（SEM）、X射线衍射仪（XRD）和俄歇电子能谱仪（AES）研究了化学镀Ni-Cu-P存款层与InSn钎料润湿过程中的相互作用。在250-300/spl deg/C温度范围内，51 In-49 Sn和80 In-20 Sn体系的Ni-Cu-P合金在中间层形成了In/sub 3/Ni/sub 2/和In/sub 27/Ni/sub 10/金属间化合物。除了这两种金属间化合物Ni/sub 3/Sn/sub 4/也与20 In-80 Sn系统形成。随着温度的升高，Ni/sub 3/Sn/sub 4/逐渐消失。揭示了在250-325/spl deg/C温度范围内InSn焊料润湿Ni-Cu-P存款的两阶段润湿机理。
The interactions during wetting between an electroless Ni-Cu-P deposit and molten InSn solders were investigated with the aid of scanning electron microscope (SEM), X-ray diffractometer (XRD), and Auger electron spectroscope (AES). The intermetallics In/sub 3/Ni/sub 2/ and In/sub 27/Ni/sub 10/ were formed at the interlayer for the Ni-Cu-P with 51In-49Sn and 80In-20Sn systems, in the temperature range of 250-300/spl deg/C. In addition to these two intermetallic compounds Ni/sub 3/Sn/sub 4/ was also formed with the 20In-80Sn system. The Ni/sub 3/Sn/sub 4/ dissipates gradually with increasing temperature. A two-stage wetting mechanism was disclosed for the wetting of Ni-Cu-P deposit with the InSn solders in the temperature range of 250-325/spl deg/C.