Subiyanto, B.; Kawai, S.; Sasaki, H.; Tanahashi, M.: "-do- II. Curing adhesives under high steam pressure or temperature -do- III. Optimum condition of curing adhesives in steam-injection pressing of particleboard" Mokuzai Gakkai-shi. 35. (1989)
Subiyanto, B.; Kawai, S.; Sasaki, H.; Tanahashi, M.: "-do- II. Curing adhesives under high steam pressure or temperature -do- III. Optimum condition of curing adhesives in steam-injection pressing of particleboard" Mokuzai Gakkai-shi. 35. (1989)
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苏比延托，B.；
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