Research Progress of Interfacial Design between Thermoelectric Materials and Electrode Materials.
Research Progress of Interfacial Design between Thermoelectric Materials and Electrode Materials.
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DOI：
10.1021/acsami.2c21035
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发表时间：
2023-03
影响因子：
9.5
通讯作者：
Wenkai Le;Wen-Kun Yang;Wenwen Sheng;J. Shuai
中科院分区：
文献类型：
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作者：
Wenkai Le;Wen-Kun Yang;Wenwen Sheng;J. Shuai
实现热电材料与电极材料的低界面接触电阻的可靠界面连接是实现热电材料工业化应用的关键。在这篇综述中，首先概述了热电模块的结构完整性、相互扩散和接触电阻在长期可靠性中的作用。然后对近室温Bi_2Te_3基热电材料与各种电极材料的界面反应进行了综述。总结了中温PbTe基热电材料与常用电极材料的连接行为。随后，对于其他热电材料系统，即，还概述了之前与一些电极材料连接的尝试。最后，对进一步提高热电器件制造中的接头可靠性提出了展望。我们相信，这一审查将提供指导热电器件的制备和优化热电器件的设计。
Intensive efforts have been conducted to realize the reliable interfacial joining of thermoelectric materials and electrode materials with low interfacial contact resistance, which is an essential step to make thermoelectric materials into thermoelectric devices for industrial application. In this review, the roles of structural integrity, interdiffusion, and contact resistance in long-term reliabilities of thermoelectric modules are outlined first. Then interfacial reactions of near-room-temperature Bi2Te3-based thermoelectric materials and various electrode materials are reviewed comprehensively. We also summarized the joining behavior of the mid-temperature PbTe-based thermoelectric materials and commonly used electrode materials. Subsequently, for other thermoelectric materials systems, i.e., SiGe, CoSb3, and Mg3Sb2, previous attempts to join with some electrode materials are also recapitulated. Finally, some future prospects to further improve the joint reliability in thermoelectric device manufacturing are proposed. We believe that this review will provide guidance for preparing thermoelectric devices and optimizing thermoelectric device design.