Misfit dislocation network in Cu/Ni multilayers and its behaviors during scratching
Misfit dislocation network in Cu/Ni multilayers and its behaviors during scratching
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DOI：
10.1016/j.tsf.2006.10.001
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发表时间：
2007-02-26
期刊：
影响因子：
2.1
通讯作者：
Yan, Li
中科院分区：
文献类型：
--
作者：
Cheng, Dong;Yan, Zhi Jun;Yan, Li
采用三维分子动力学模拟方法研究了Cu-Ni界面失配位错的结构和分布及其对Ni膜摩擦学性能的影响。Cu-Ni界面处的错配位错网络结构因薄膜相对于衬底的晶向不同而不同：在（111）Cu平行于（111）Ni界面处观察到三角形错配位错网络，在（001）Cu平行于（001）Ni界面处观察到正方形错配位错网络。它们在Cu/Ni多层膜的强化中起着重要的作用。在镍膜上的单个微凸接触的划痕过程中，失配位错网络成为滑移位错的重要障碍。摩擦力与法向载荷的关系曲线呈现出一个水平阶段，表明由于失配位错网络的存在，摩擦系数降低。(c)2006 Elsevier B. V.保留所有权利。
The structure and distribution of misfit dislocations at Cu-Ni interfaces and their effects on the tribological behavior of a Ni film are investigated with 3D Molecular Dynamic Simulations. The structure of misfit dislocation network at a Cu-Ni interface differs according to different crystallographic orientations of the film relative to the substrate: a triangle and square type of misfit dislocation network are observed at (111)Cu parallel to(111)Ni and (001)Cu parallel to(001)Ni interfaces respectively. They play an important role in the strengthening of Cu/Ni multilayers. During the scratching of a single asperity contact on the Ni film, the misfit dislocation network becomes a significant barrier to the glide dislocations. The plot of friction force vs. normal load when scratching on the Ni film exhibits a horizontal stage, representing the decreasing of the frictional coefficient due to the existence of the misfit dislocations network. (c) 2006 Elsevier B.V. All rights reserved.