Atmospheric Modified Thiol-Based Solution Deposition for Cu2ZnSn(S,Se)4 Absorber Layer

Atmospheric Modified Thiol-Based Solution Deposition for Cu2ZnSn(S,Se)4 Absorber Layer
复制标题

Cu2ZnSn(S,Se)4 吸收层的常压改性硫醇溶液沉积

DOI:
10.1007/s11664-020-08375-5
复制
发表时间:
2020-08
影响因子:
2.1
通讯作者:
O. Tegus
O. Tegus
中科院分区:
工程技术4区
文献类型:
--
作者:
Ruilan Chen;Guonan Cui;Yanchun Yang;Yuemin Li;H. Alata;Xiao Tian;O. Tegus

文献摘要

参考文献

相似文献

为了进一步降低器件的生产成本,放弃了传统的在手套箱中沉积Cu2ZnSnS4(CZTS)薄膜的方法,提出了一种适用于空气中沉积的改进的硫醇溶液体系。在改进的方法中,以金属盐和硫脲为原料,将其溶解在硫代乙醇酸和2-甲氧基乙醇的混合溶液中,形成均匀的前驱体溶液。采用先驱体溶液在空气中旋涂的方法制备了CZTS薄膜,然后进行了硒化处理,得到了大颗粒的Cu2ZnSn4(S,Se)4薄膜。结合显微组织分析和成分分析,得出Cu2ZnSn4(S,Se)4吸收层的最佳渗硒条件为540℃,10min。
Abandoning the traditional deposition of as-prepared Cu2ZnSnS4 (CZTS) thin films in a glove box, a modified thiol-based solution system suitable for deposition in air is described to further reduce device production costs. In this modified approach, metal salts and thiourea are used as the starting materials and are dissolved in a mixed solution of thioglycolic acid and 2-methoxyethanol, forming a homogeneous precursor solution. The as-deposited CZTS thin films are obtained by spin-coating the precursor solution in air, followed by the selenization process to form large-grained Cu2ZnSn(S,Se)4 thin films. Combining the microstructural results with compositional analyses, the optimal selenization conditions for the Cu2ZnSn(S,Se)4 absorber layer were found to be 540°C and 10 min.
DOI: 10.1021/am401210w
发表时间: 2013-05-22
影响因子: 9.5
作者:
Cho, Jin Woo;Ismail, Agus;Min, Byoung Koun
通讯作者: Min, Byoung Koun
DOI: 10.1016/j.solmat.2010.12.012
发表时间: 2011-03
影响因子: 6.9
作者:
Tejas Prabhakar;N. Jampana
通讯作者: Tejas Prabhakar;N. Jampana
DOI: 10.1002/adfm.201703369
发表时间: 2018-04-05
影响因子: 19
作者:
Gu, Youchen;Shen, Heping;Lin, Hong
通讯作者: Lin, Hong
DOI: 10.1002/aenm.201301465
发表时间: 2014-05-01
影响因子: 27.8
作者:
Wang, Wei;Winkler, Mark T.;Mitzi, David B.
通讯作者: Mitzi, David B.
DOI: 10.1016/j.cap.2014.11.005
发表时间: 2015-02
影响因子: 2.4
作者:
S. Pawar;A. Inamdar;K. Gurav;S. Shin;J. Gwak;Y. Jo;J. Yun;H. Pak;S. Kwon;Hyungsang Kim;J. H. Kim;H. Im
通讯作者: S. Pawar;A. Inamdar;K. Gurav;S. Shin;J. Gwak;Y. Jo;J. Yun;H. Pak;S. Kwon;Hyungsang Kim;J. H. Kim;H. Im