Physical characteristics of polyimide films for flexible sensors
Physical characteristics of polyimide films for flexible sensors
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DOI：
10.1007/s00339-008-4623-y
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发表时间：
2008-08-01
影响因子：
2.7
通讯作者：
Lin, Yu-Cheng
中科院分区：
文献类型：
--
作者：
Chang, Wen-Yang;Fang, Te-Hua;Lin, Yu-Cheng
聚酰亚胺薄膜的物理特性，包括光学，微/纳米机械，和热物理特性进行了研究，使用光度计，纳米压痕，和热机械分析仪在柔性传感器中的应用。实验结果表明，紫外光不能透过聚酰亚胺薄膜。在维斯和近红外光下的透射率随PI膜厚度的增加而减小，最大值约为86%。使用拉伸、弯曲力矩和纳米压痕测试来确定机械特性。应力-应变曲线近似双线性特征，加载-卸载弯矩呈现滞后现象，纳米压痕在加载-卸载区域产生弹性能量耗散。纳米压痕显示出几乎均匀的硬度和约0.181 +/- 0.03和3.21 +/- 0.06 GPa的降低的杨氏模量，分别当穿透深度大于约2 μ m。8.3和25 μ m的标本，由于薄PI膜的较高的松弛的热物理特性的影响很大。当厚度超过50 μ m时，热膨胀保持稳定。结果表明，PI薄膜在柔性传感和高温加工方面具有潜力。
Physical characteristics of polyimide films, including optical, micro/nano mechanical, and thermophysical characteristics were investigated using a photometric, a nanoindentation, and a thermomechanical analyzer for applications in flexible sensors. Experimental results show that UV light cannot transmit into the polyimide films. The transmittances, with a maximum of about 86%, at VIS and near IR lights decrease with increasing PI film thicknesses. The mechanical characteristics were determined using tensile, bending moment, and nanoindentation testing. The stress-strain curve approximated bilinear characteristics, the load-unload bending moment exhibited hysteresis, and nanoindentation generated elastic energy dissipation in the loading-unloading region. Nanoindentation showed an almost uniform hardness and a reduced Young's modulus of about 0.181 +/- 0.03 and 3.21 +/- 0.06 GPa, respectively, when the penetrating depth was more than about 2 mu m. Thermophysical characteristics were greatly influenced on 8.3 and 25 mu m specimens due to the higher relaxation of thin PI films. The thermal expansion remained steady when the thickness was over 50 mu m. The results show that PI films have potential in flexible sensing and higher temperature fabrication.