Spreading of Sn-Ag-Ti and Sn-Ag-Ti(-Al) solder droplets on the surface of porous graphite through ultrasonic vibration
Spreading of Sn-Ag-Ti and Sn-Ag-Ti(-Al) solder droplets on the surface of porous graphite through ultrasonic vibration
复制标题
超声波振动使 Sn-Ag-Ti 和 Sn-Ag-Ti(-Al) 焊料液滴在多孔石墨表面铺展
DOI：
10.1016/j.matdes.2018.04.028
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发表时间：
2018-07
影响因子：
8.4
通讯作者：
Liu Xinya
中科院分区：
文献类型：
--
作者：
Yu Weiyuan;Liu Yun;Liu Xinya
利用高速摄像机拍摄了活性钎料液滴在多孔石墨表面的铺展过程。分析了Sn5Ag8Ti和Sn5Ag2Ti1Al活性钎料在超声振动下的铺展特性。结果表明，在钎焊过程中施加超声波，可使活性钎料在大气条件下较低的温度下在石墨表面铺展。最初，由于超声波振幅在石墨表面上的快速衰减，焊料在与超声波传输方向相反的方向上在石墨表面上缓慢扩散。在超声振动作用下，钎料迅速填充石墨孔隙，阻止了超声衰减。随后，焊料沿传输方向沿着迅速扩散。此外，Sn5Ag8Ti的铺展距离和铺展速率明显小于Sn5Ag2Ti1Al钎料，这是由活性钎料表面氧化膜的成分和厚度决定的。
The spreading process of an active solder droplet on porous graphite surface was captured by using high-speed camera. The spreading characteristics of the Sn5Ag8Ti and Sn5Ag2Ti1Al active solder under ultrasonic vibrations were analysed. The results showed that applying ultrasonic waves during the soldering process enable the active solder to spread on the graphite surface at a relatively low temperature under atmospheric condition. Initially, the solder spread slowly on the graphite surface in the direction opposite to that of the ultrasonic wave transmission because of the rapid attenuation of ultrasonic amplitude on the surface of the graphite. Then graphite pores were rapidly filled with solder under the action of ultrasonic vibration, which prevented the ultrasonic attenuation. Subsequently, the solder spread out rapidly along the direction of transmission. In addition, the spreading distance and rate of Sn5Ag8Ti were significantly less than that of Sn5Ag2Ti1Al solder, which was determined by the composition and thickness of the oxide film on the surface of the active solder.
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影响因子：
6.2
作者：
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DOI：
10.1016/j.compositesa.2011.12.006
发表时间：
2012-03-01
影响因子：
8.7
作者：
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