Micro 3D measurement method using SEM
Micro 3D measurement method using SEM
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DOI：
10.1007/s12647-011-0007-4
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发表时间：
2011-05
期刊：
影响因子：
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通讯作者：
Y. Arai;M. Ando;S. Kanameishi;S. Yokozeki
中科院分区：
文献类型：
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作者：
Y. Arai;M. Ando;S. Kanameishi;S. Yokozeki
利用阴影莫尔条纹的原理，已经提出了通过扫描电子显微镜（SEM）进行三维（3D）测量方法。该方法中，在条纹分析过程中必须清楚地去除阴影云纹图像中的原始网格图像，才能进行高分辨率分析。提出了一种基于投影莫尔条纹原理的新方法来解决网格问题。本文讨论了新方法中背散射电子束在物体表面产生网格阴影的机理。采用小波变换对作为网格阴影的条纹图像进行分析。利用网格阴影现象实现精确的3D测量。此外，还测量了硬盘磁头上的3D微观结构。通过与原子力显微镜（AFM）结果的比较，证实该方法具有高分辨率（约20nm）。
Three diamensional (3D) measurement method by Scanning Electron Microscope (SEM) has already been proposed by using the principle of shadow moiré. In the method, the image of original grid in shadow moiré image must be clearly removed in fringe analysis process in order to perform high resolution analysis. A new method based on the principle of projection moiré is proposed to solve the trouble concerning the grid. In this paper, the mechanism of producing some shadows of grid on the surface of the object by back scattering electron beam in the new method is discussed. Fringe image as shadow of grid is analyzed by Wavelet transform. The precise 3D measurement is realized by using the phenomenon of shadows of grid. Furthermore, a 3D micro structure on the head of a hard disk is measured. From the comparison of results obtained by Atomic Force Microscope (AFM), it is confirmed that the proposed method has high-resolution power(about 20nm).