Fabrication of IR-transparent microfluidic devices by anisotropic etching of channels in CaF2
Fabrication of IR-transparent microfluidic devices by anisotropic etching of channels in CaF2
复制标题
DOI：
10.1039/c5lc00759c
复制
发表时间：
2015-01-01
期刊：
影响因子：
6.1
通讯作者：
Henry, Charles S.
中科院分区：
文献类型：
--
作者：
Lehmkuhl, Brynson;Noblitt, Scott D.;Henry, Charles S.
一个简单的制造方法，用于产生红外（IR）透明的微流体器件使用蚀刻CaF 2的演示。为了蚀刻微流体通道，将聚（二甲基硅氧烷）（PDMS）微流体装置可逆地密封在CaF 2板上，并将酸泵送通过通道网络以进行下面的CaF 2表面的各向异性蚀刻。为了完成CaF 2微流体装置，使用700 nm厚的PDMS粘合剂层将另一个CaF 2板密封在蚀刻的通道上。研究了不同酸及其浓度对蚀刻的影响，其中HNO 3在通道粗糙度和蚀刻速率方面给出了最佳结果。在4-48小时的蚀刻时间范围内测定蚀刻速率，并显示出与蚀刻时间的线性相关性。使用傅里叶变换红外显微镜建立了CaF 2器件的红外透明性，并表明该器件可用于中红外区域。最后，通过跟踪N-甲基乙酰胺和D2 O的反应证明了该装置的实用性，使用FTIR显微镜，该反应导致酰胺峰从1650 cm（-1）移动到1625 cm（-1）。
A simple fabrication method for generating infrared (IR) transparent microfluidic devices using etched CaF2 is demonstrated. To etch microfluidic channels, a poly(dimethylsiloxane) (PDMS) microfluidic device was reversibly sealed on a CaF2 plate and acid was pumped through the channel network to perform anisotropic etching of the underlying CaF2 surface. To complete the CaF2 microfluidic device, another CaF2 plate was sealed over the etched channel using a 700 nm thick layer of PDMS adhesive. The impact of different acids and their concentrations on etching was studied, with HNO3 giving the best results in terms of channel roughness and etch rates. Etch rate was determined at etching times ranging from 4-48 hours and showed a linear correlation with etching time. The IR transparency of the CaF2 device was established using a Fourier Transform IR microscope and showed that the device could be used in the mid-IR region. Finally, utility of the device was demonstrated by following the reaction of N-methylacetamide and D2O, which results in an amide peak shift to 1625 cm(-1) from 1650 cm(-1), using an FTIR microscope.