A curious observation of phenomena occurring during lapping/polishing processes
A curious observation of phenomena occurring during lapping/polishing processes
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对研磨/抛光过程中发生的现象的好奇观察
DOI：
10.1098/rspa.2019.0304
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发表时间：
2019-10
影响因子：
3.5
通讯作者：
Axinte Dragos
中科院分区：
文献类型：
--
作者：
Yang Yue;Li Hao Nan;Liao Zhirong;Axinte Dragos
我们证明，抛光过程的运动学比之前所有研究报告的理想化行星运动更有趣。实际上，工件受到行星架的伪约束，因此其与抛光垫的相对运动也会引起以前未观察到的“寄生”运动。在这里，我们报告并模拟这种寄生运动，并量化其对工件表面粗糙度的影响。使用运动捕捉系统，可以跟踪样品和抛光工具之间的主要运动和“寄生”运动，并验证我们的模型。事实证明，考虑到这种寄生运动，与理想化方法（即行星法）相比，工件表面形态的预测可以得到显着改善。我们的观察和建模框架为仔细考虑其他制造过程中工具和工件之间的合规性开辟了道路，以准确预测过程结果。
We demonstrate that the kinematics of the polishing process is more intriguing than an idealized planetary movement as all the previous studies reported. In reality, the workpiece is pseudo-constrained by the planetary carrier and because of this its relative motion to the polishing pad also incurs a ‘parasitic’ movement that previously has not been observed. Here, we report and model this parasitic movement and quantify its effect upon the workpiece surface roughness. Using a motion capture system, the principal and ‘parasitic’ movements between the sample and polishing tool have been tracked and our models validated. It is proved that considering this parasitic movement the prediction of workpiece surface morphology can be significantly improved when compared with the idealized approach (i.e. planetary). Our observations and modelling framework open the avenue to carefully consider the compliance between the tools and workpiece in other manufacturing processes for accurate predictions of the process outcomes.
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