Evolvable hardware solutions for extreme temperature electronics
Evolvable hardware solutions for extreme temperature electronics
复制标题
适用于极端温度电子产品的可进化硬件解决方案
DOI：
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发表时间：
2001
期刊：
影响因子：
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通讯作者：
R. Zebulum
中科院分区：
文献类型：
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作者：
A. Stoica;D. Keymeulen;R. Zebulum
耐温度和耐辐射电子设备以及长寿命生存能力是未来NASA任务所需的关键能力。目前针对极端环境的电子产品的方法集中在组件级的稳健性和硬化上。补偿技术，如偏置消除电路也被采用。然而，目前的技术只能确保在极端环境下非常有限的使用寿命。本文提出了一种基于可进化硬件技术的新方法，该方法可以在极端环境下进行自适应的原位电路重新设计/重新配置。该技术将补充材料/设备的进步，并增加在恶劣环境中生存的任务能力。该方法在原型芯片上进行了演示，该芯片在250/spl度/C下恢复功能。除了提供自适应重构的应用之外，进化算法还可以用于自动设计（固定）高温电路。虽然模拟表明传统的与栅极设计在320/spl°C等高温下失效，但evolution能够合成在该温度下精确工作的与栅极电路。
Temperature and radiation tolerant electronics, as well as long life survivability are key capabilities required for future NASA missions. Current approaches to electronics for extreme environments focus on component level robustness and hardening. Compensation techniques such as bias cancellation circuitry have also been employed. However, current technology can only ensure very limited lifetime in extreme environments. This paper presents a novel approach, based on evolvable hardware technology, which allows adaptive in-situ circuit redesign/reconfiguration during operation in extreme environments. This technology would complement material/device advancements and increase the mission capability to survive harsh environments. The approach is demonstrated on a prototype chip, which recovers functionality at 250/spl deg/C. Besides the applications that provide adaptive reconfiguration, evolutionary algorithms can be used to automatically design (fixed) circuits for high temperatures. While simulations show that conventional AND gate design fails at high temperatures such as 320/spl deg/C, evolution is able to synthesize AND gate circuits operating accurately at this temperature.