Effects of mixed ultrafine colloidal silica particles on chemical mechanical polishing of sapphire
Effects of mixed ultrafine colloidal silica particles on chemical mechanical polishing of sapphire
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DOI：
10.7567/jjap.57.07md03
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发表时间：
2018-06
影响因子：
1.5
通讯作者：
Natthaphon Bun-Athuek;H. Takazaki;Yuta Yoshimoto;P. Khajornrungruang;T. Yasunaga;Keisuke Suzuki
中科院分区：
文献类型：
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作者：
Natthaphon Bun-Athuek;H. Takazaki;Yuta Yoshimoto;P. Khajornrungruang;T. Yasunaga;Keisuke Suzuki
研究了蓝宝石化学机械抛光液中大颗粒二氧化硅表面吸附的超细二氧化硅胶体颗粒对抛光效果的影响。使用由超细（4nm）胶态二氧化硅颗粒和大（20、55和105nm）二氧化硅颗粒的混合物组成的混合二氧化硅颗粒抛光蓝宝石晶片。动态光散射结果表明，混合后的杂化粒子变大。透射电子显微镜图像显示，超细颗粒粘附在大颗粒的表面上，并且混合颗粒的表面形状通过混合过程而改变。原子力显微镜和抛光实验结果表明，杂化粒子的加入提高了蓝宝石衬底的表面粗糙度和材料去除率。蓝宝石衬底的表面和混合颗粒之间的摩擦系数高于使用单一尺寸的颗粒获得的摩擦系数。这些结果证实了混合二氧化硅颗粒增强了蓝宝石抛光的性能。
The effects of ultrafine colloidal silica particles adsorbed on the surfaces of large silica particles in slurries used for the chemical mechanical polishing of sapphire were studied. Sapphire wafers were polished using hybrid silica particles that were composed of a mixture of ultrafine (4 nm) colloidal silica particles and large (20, 55, and 105 nm) silica particles. Dynamic light scattering results showed that the hybrid particles became larger after mixing. Transmission electron microscopy images revealed that the ultrafine particles adhered to the surfaces of the large particles and that the surface shape of the hybrid particles were changed by the mixing process. Atomic force microscopy and polishing results showed that the surface roughnesses and material removal rates of sapphire substrates were improved by using the hybrid particles. The coefficient of friction between the surface of the sapphire substrate and the hybrid particles was higher than that obtained using single-sized particles. These results confirm that the hybrid silica particles enhanced the performance of sapphire polishing.