Active Membranes on Rigidity Tunable Foundations for Programmable, Rapidly Switchable Adhesion
Active Membranes on Rigidity Tunable Foundations for Programmable, Rapidly Switchable Adhesion
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DOI：
10.1002/admt.202000676
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发表时间：
2020-09
影响因子：
6.8
通讯作者：
Matthew D. Swift;Cole B. Haverkamp;C. J. Stabile;Dohgyu Hwang;R. Plaut;K. Turner;D. Dillard;Michael D. Bartlett
中科院分区：
文献类型：
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作者：
Matthew D. Swift;Cole B. Haverkamp;C. J. Stabile;Dohgyu Hwang;R. Plaut;K. Turner;D. Dillard;Michael D. Bartlett
快速控制和切换粘附力对于机器人抓取和移动、拾取和放置操作以及转印中的应用是必要的。然而，可转换粘合剂通常显示具有窄粘合范围的二元响应（开或关），缺乏制造后粘合可调性，或由于扩散控制过程而缓慢转换。在这里，可编程控制的形状和刚度调整被耦合到快速切换附着力（± 0.1秒）在广泛的可编程附着力与测量切换比高达1300倍。可切换的粘附系统引入了一种活性聚二甲基硅氧烷膜，该膜支撑在具有压力可调刚度的柔性泡沫基础上，其中正负气动压力协同控制接触刚度和几何形状，以激活和释放粘附力。基于能量的建模和有限元计算表明，高附着力是通过基础的压力依赖性非线性刚度实现的，而正压下的膨胀形状可以轻松释放。这种方法实现了基于粘附力的夹持和材料组装，可用于拾取和释放常见物体、粗糙和多孔材料以及质量范围大于14000x的元件阵列。然后，展示了不同组件（刚性、柔性、柔性）的坚固组装，以创建柔软且可拉伸的电子设备。
Rapidly controlling and switching adhesion is necessary for applications in robotic gripping and locomotion, pick and place operations, and transfer printing. However, switchable adhesives often display a binary response (on or off) with a narrow adhesion range, lack post‐fabrication adhesion tunability, or switch slowly due to diffusion‐controlled processes. Here, pneumatically controlled shape and rigidity tuning is coupled to rapidly switch adhesion (≈0.1 s) across a wide range of programmable adhesion forces with measured switching ratios as high as 1300x. The switchable adhesion system introduces an active polydimethylsiloxane membrane supported on a compliant, foam foundation with pressure‐tunable rigidity where positive and negative pneumatic pressure synergistically control contact stiffness and geometry to activate and release adhesion. Energy‐based modeling and finite element computation demonstrate that high adhesion is achieved through a pressure‐dependent, nonlinear stiffness of the foundation, while an inflated shape at positive pressures enables easy release. This approach enables adhesion‐based gripping and material assembly, which is utilized to pick‐and‐release common objects, rough and porous materials, and arrays of elements with a greater than 14 000x range in mass. The robust assembly of diverse components (rigid, soft, flexible) is then demonstrated to create a soft and stretchable electronic device.