The FE-I4 Pixel Readout Chip and the IBL Module
The FE-I4 Pixel Readout Chip and the IBL Module
复制标题
DOI：
--
复制
发表时间：
2011
期刊：
影响因子：
--
通讯作者：
M. Barbero;D. Arutinov;M. Backhaus;Xiaochao Fang;L. Gonella;T. Hemperek;M. Karagounis;Hans Krüger;A. Kruth;N. Wermes;P. Breugnon;D. Fougeron;F. Gensolen;M. Menouni;Sasha Rozanov;R. Beccherle;G. Darbo;L. Caminada;S. Dube;Julien Fleury;D. Gnani;M. Garcia-Sciveres;F. Jensen;Yunpeng Lu;A. Mekkaoui;V. Gromov;R. Kluit;J. Schipper;V. Zivkovic;J. Grosse-Knetter;J. Weingarten;M. Kocian
中科院分区：
文献类型：
--
作者：
M. Barbero;D. Arutinov;M. Backhaus;Xiaochao Fang;L. Gonella;T. Hemperek;M. Karagounis;Hans Krüger;A. Kruth;N. Wermes;P. Breugnon;D. Fougeron;F. Gensolen;M. Menouni;Sasha Rozanov;R. Beccherle;G. Darbo;L. Caminada;S. Dube;Julien Fleury;D. Gnani;M. Garcia-Sciveres;F. Jensen;Yunpeng Lu;A. Mekkaoui;V. Gromov;R. Kluit;J. Schipper;V. Zivkovic;J. Grosse-Knetter;J. Weingarten;M. Kocian
FE-I4是升级版ATLAS像素探测器的新型ATLAS像素读出芯片。该IC采用CMOS 130 nm特征尺寸工艺设计，与当前一代ATLAS像素前端FE-I3相比，能够承受更高的辐射水平，并且还可以应对更高的命中率。因此，它适用于中间半径像素探测器层
FE-I4 is the new ATLAS pixel readout chip for the upgraded ATLAS pixel detector. Designed in a CMOS 130 nm feature size process, the IC is able to withstand higher radiation levels compared to the present generation of ATLAS pixel Front-End FE-I3, and can also cope with higher hit rate. It is thus suitable for intermediate radii pixel detector layers in