Investigation on the dual-phase co-deformation behavior and strengthening mechanism in cold-drawn Cu–20Fe alloy

Investigation on the dual-phase co-deformation behavior and strengthening mechanism in cold-drawn Cu–20Fe alloy
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冷拉Cu−20Fe合金双相共变形行为及强化机制研究

DOI:
10.1016/j.msea.2022.144474
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发表时间:
2023
期刊:
Materials Science and Engineering: A
影响因子:
--
通讯作者:
Tingju Li
Tingju Li
中科院分区:
其他
文献类型:
--
作者:
Shipeng Yue;Guoliang Li;Jianping Qu;Shichao Liu;Zhongkai Guo;Jinchuan Jie;Shengli Guo;Tingju Li

文献摘要

相似文献

在这项工作中,冷拔变形的应用旨在实现 Cu-20Fe 合金强度和电导率的良好结合,并阐明了微观结构演变和强化以及电导率变化的潜在机制。研究还发现,随着拉拔应变的增加,Cu基体晶粒和富Fe枝晶都会显着细化并转变为纤维结构。对于经受拉拔应变 η= 5.78 的合金,Cu 晶粒的平均尺寸和 Fe 纤维的厚度分别为 0.47 ± 0.05 μm 和 25 ± 5 nm。此外,Fe枝晶表现出强烈的<110>纤维织构,而相应的Cu基体则形成<111>纤维织构。结果表明,冷拉 Cu-20Fe 合金具有屈服强度 1173 MPa 和电导率 41 %IACS 的优异性能。此外,对强化贡献的定量分析表明,拉制Cu-20Fe合金的高强度主要来源于高密度Fe纤维。同时,较低的电导率归因于高固溶Fe含量和高密度的Cu/Fe异质相界面。
In this work, cold drawing deformation was applied aiming to achieve a good combination of strength and electrical conductivity of Cu–20Fe alloy, and also such underlying mechanisms for microstructure evolution and strengthening, as well as variation in conductivity were clarified. It is also found that both Cu matrix grains and Fe-rich dendrites can be significantly refined and transformed into fibrous structure with increasing of drawing strain. The average size of Cu grains and thickness of Fe fiber are 0.47 ± 0.05 μm and 25 ± 5 nm, respectively for alloy subjected to the drawing strain ofη= 5.78. In addition, the Fe dendrites exhibit a strong <110> fiber texture, while the corresponding Cu matrix forms a <111> fiber texture. It is demonstrated that the excellent properties with the yield strength of 1173 MPa and the electrical conductivity of 41 %IACS can be reached for cold-drawn Cu–20Fe alloy. In addition, the quantitative analysis on strengthening contributions shows that the high strength of as-drawn Cu–20Fe alloy is dominantly originated from high-density Fe fibers. Meanwhile, the lower electrical conductivity is ascribed to the high solute Fe content and high-density Cu/Fe heterogeneous phase interface.