Microstructure and strengthening mechanisms in Cu/Fe multilayers
Microstructure and strengthening mechanisms in Cu/Fe multilayers
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DOI：
10.1016/j.actamat.2012.08.005
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发表时间：
2012-10
期刊：
影响因子：
9.4
通讯作者：
Youxing Chen;Yue Liu;Cheng Sun;Kai Yu;M. Song;H. Wang;Xinghang Zhang
中科院分区：
文献类型：
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作者：
Youxing Chen;Yue Liu;Cheng Sun;Kai Yu;M. Song;H. Wang;Xinghang Zhang
用磁控溅射法在Si（110）和Si（100）衬底上制备了Cu/Fe纳米多层膜，单层膜厚h为0.75 ~ 200 nm。Cu和Fe在界面处的生长取向关系被确定为Kurdjumov-Sachs和Nishiyama-Wasserman型。当h ≤ 50 nm时，Fe中的纳米柱状晶在强化机制中起主导作用，平均晶粒尺寸为11- 23 nm。当h较小时，Cu/Fe多层膜的（100）织构硬度接近峰值，随后由于形成完全共格的界面而发生软化。当h=0.75nm时，Cu/Fe多层膜中（111）织构的孪晶大量存在，从而使多层膜保持了较高的硬度。
Nanostructured Cu/Fe multilayers on Si (110) and Si (100) substrates were prepared by magnetron sputtering, with individual layer thicknesses h varying from 0.75 to 200nm. The growth orientation relationships between Cu and Fe at the interfaces were determined to be of the Kurdjumov–Sachs and Nishiyama–Wasserman type. Nanoscale columnar grains in Fe, with an average grain size of 11–23nm, played a dominant role in the strengthening mechanism when h⩾50nm. At smaller h the hardness of Cu/Fe multilayers with (100) texture approached a peak value, followed by softening due to the formation of fully coherent interfaces. However, abundant twins were observed in Cu/Fe films with (111) texture when h=0.75nm, which led to the retention of high hardness in the multilayers.