The effect of Re and Ru on γ/γ′ microstructure, γ-solid solution strengthening and creep strength in nickel-base superalloys
The effect of Re and Ru on γ/γ′ microstructure, γ-solid solution strengthening and creep strength in nickel-base superalloys
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DOI：
10.1016/j.msea.2011.01.023
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发表时间：
2011-04-15
期刊：
影响因子：
6.4
通讯作者：
Singer, R. F.
中科院分区：
文献类型：
--
作者：
Heckl, A.;Neumeier, S.;Singer, R. F.
研究了自行设计的一系列逐步增加Re和Ru元素的镍基高温合金，系统地研究了Re和Ru元素对合金的伽马/伽马‘组织和高温蠕变性能的影响。稀土的加入改善了合金的蠕变抗力，合金的温度能力也提高到了87K/at.%。对于低Re含量的第二代合金，Ru的加入使合金的低温性能提高了38K/at.%。然而，在Re含量较高的第三代和第四代合金中，Ru对蠕变断裂强度没有显著影响。讨论了不同Re和Ru合金的伽马‘体积分数、伽马’尺寸和伽马‘粗化率、伽马/伽马’晶格失配和伽马/伽马‘分配系数等蠕变性能。结果表明，Re的加入对这些显微组织参数的影响很大，而Ru的影响很小。伽马基体的固溶硬化对持久强度有进一步的影响，这一点是基于实验得出的或由ThermoCalc数据计算的固溶硬化剂浓度来讨论的。(C)2011爱思唯尔B.V.保留所有权利。
A new in-house designed series of Ni based superalloys with stepwise increased Re and Ru additions has been investigated, to systematically determine the influence of Re and Ru on gamma/gamma'-microstructure and high temperature creep properties. Improved creep resistance and thus also a higher alloy temperature capability of up to 87 K/at.% was found for additions of Re. Additions of Ru revealed a lower temperature capability improvement of up to 38 K/at.% for low Re-containing second generation alloys. However, in third and fourth generation alloys with higher Re-contents, no significant influence of Ru on creep rupture strength was observed. The creep properties are discussed with respect to the gamma'-volume fraction, gamma'-size and gamma'-coarsening rate, as well as the gamma/gamma'-lattice misfit and the gamma/gamma' partitioning coefficient of the different Re and Ru containing alloys. The presented data shows, that these microstructure parameters are strongly influenced by additions of Re, but only marginally by additions of Ru. A further influence on creep rupture strength is given by the solid solution hardening of the gamma-matrix, which is discussed based on solid solution hardener concentrations either experimentally derived or calculated from ThermoCalc data. (C) 2011 Elsevier B.V. All rights reserved.