Heat Conduction in Multilayered Thermoelectric Materials with Multiple Cracks
Heat Conduction in Multilayered Thermoelectric Materials with Multiple Cracks
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DOI：
10.1007/s10338-018-0037-3
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发表时间：
2018-07
影响因子：
2.2
通讯作者：
S. Ding;Yueting Zhou
中科院分区：
文献类型：
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作者：
S. Ding;Yueting Zhou
多层薄膜热电材料具有重要的技术意义。本文介绍了一种分析含有非共线裂纹的多层热电板热传导的方法。尽管每一层可能仍然是均匀的，但一层中的材料特性可能与另一层中的材料特性不同。使用傅立叶积分变换，边值问题被简化为一般奇异积分方程组。该模型足够通用，可以解释任意数量的层和任意数量的裂缝。作为数值说明，给出了具有两个裂纹的三层板试样的电通量强度因子、能通量强度因子和热通量强度因子。研究了带材宽度对电通量强度因子和热通量强度因子的影响。
Multilayer thin-film thermoelectric materials are of technological importance. This paper describes a method to analyze the heat conduction in a multilayered thermoelectric plate containing some non-collinear cracks. The material properties in one layer may be different from those in another even though each layer may still be homogeneous. Using the Fourier integral transforms, the boundary value problem is reduced to a system of general singular integral equations. The model is sufficiently general to account for any number of layers and any number of cracks. As a numerical illustration, the electric flux intensity factor, energy flux intensity factor and thermal flux intensity factor for a three-layer plate specimen with two cracks are presented. The effects of strip width on the electric flux intensity factor and thermal flux intensity factor are studied.