Thermal properties of W-Cu composites manufactured by copper infiltration into tungsten fiber matrix
Thermal properties of W-Cu composites manufactured by copper infiltration into tungsten fiber matrix
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DOI：
10.1016/j.ijrmhm.2014.05.022
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发表时间：
2014-09-01
影响因子：
3.6
通讯作者：
Yang, Guoliang
中科院分区：
文献类型：
--
作者：
Duan, Lihui;Lin, Wensong;Yang, Guoliang
采用真空环境下将铜渗入钨纤维预制棒（CHIT）技术制备了W-Cu复合材料。采用模压烧结工艺制备了不同体积分数钨纤维的纤维结构预制件。将熔融铜在真空下在1473K至1573K下渗透到预制件的开孔中1小时，以生产具有10-30wt.%铜与钨平衡的W-Cu复合材料。研究并测量了复合材料的微观结构、相对密度和热性能。随着烧结温度的升高，相对烧结密度增大。含28.2 wt.% Cu的W-Cu30复合材料在298 K时的热导率为241 W/(m·K)，比传统粉末冶金工艺生产的具有相似铜含量的W-Cu合金高10%。复合材料的热膨胀随着钨含量的增加而减小，与根据成分体积比加权平均规则预测的趋势相同。 (C) 2014 Elsevier Ltd. 保留所有权利。
W-Cu composites were produced by the technique of copper infiltration into tungsten fiber preforms (CHIT) under vacuum circumstance. Fibrous structure preforms with various volume fraction of tungsten fiber were fabricated by the process of mold pressing and sintering. The molten copper was infiltrated into the open pores of the preforms under vacuum at 1473 K to 1573 K for 1 h to produce W-Cu composites with compositions of 10-30 wt.% copper balanced with tungsten. The microstructure, relative densities, and thermal properties of the composites were investigated and measured. The relative as-sintered density was enhanced with the increase of the sintering temperature. The thermal conductivity of the W-Cu30 composite with 28.2 wt.% Cu was 241 W/(m . K) at 298 K, 10% higher than that of the W-Cu alloy with similar copper content produced by conventional powder metallurgy process. The thermal expansion of the composites was decreased with the increase of tungsten content, keeping the same tendency as the prediction by the rule of weighted average of volume ratio of compositions. (C) 2014 Elsevier Ltd. All rights reserved.