Possible debonding mode of coated film under thermal loading
Possible debonding mode of coated film under thermal loading
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热载荷下涂膜可能的脱粘模式
DOI：
10.1016/j.ijengsci.2011.04.004
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发表时间：
2011
影响因子：
6.6
通讯作者：
Shoji Imatani and Ek-u Thammakornbunjut
中科院分区：
文献类型：
--
作者：
神田純一，諸岡 聡;梅澤 修;Shoji Imatani and Ek-u Thammakornbunjut;Shoji Imatani;Shoji Imatani and Ek-u Thammakornbunjut
讨论了薄膜中的变形模式，以评估可能的脱粘机制。为了评估附着在衬底上的薄膜的热机械响应，采用了一种组合模拟技术。对节理体系进行了热弹塑性有限元分析，只选取了膜层，并参照以前分析得到的数据进行了变形分析和特征振型分析。这种方法使我们能够捕捉到薄膜层的机械刚度。从界面作用力和薄膜的离面变形两个方面讨论了衬底晶体形态的影响。
Deformation modes in thin films are discussed in order to evaluate the possible debonding mechanism. A combined simulation technique is employed in order to evaluate the thermo-mechanical response of a thin film layer attached to a substrate. A thermo-elasto-plastic finite element analysis is carried out on a jointed system, while only the film layer is picked up and both the deformation and eigen-mode analyses are implemented with reference to the data obtained in the former analysis. This approach enables us to capture the mechanical stiffness of the thin film layer. The effects of crystal morphology of substrate are discussed in terms of the interfacial force and the out-of-plane deformation of the thin film.