Automatic Material Classification Using Thermal Finger Impression
Automatic Material Classification Using Thermal Finger Impression
复制标题
使用热手指印模进行自动材料分类
DOI:
10.1007/978-3-030-37731-1_20
复制
发表时间:
2020
期刊:
影响因子:
--
通讯作者:
Dey, Soumyabrata
中科院分区:
文献类型:
--
作者:
Gately, Jacob;Liang, Ying;Kolessar Wright, Matthew;Banerjee, Natasha Kholgade;Banerjee, Sean;Dey, Soumyabrata
Natural surfaces offer the opportunity to provide augmented reality interactions in everyday environments without the use of cumbersome body-mounted equipment. One of the key techniques of detecting user interactions with natural surfaces is the use of thermal imaging that captures the transmitted body heat onto the surface. A major challenge of these systems is detecting user swipe pressure on different material surfaces with high accuracy. This is because the amount of transferred heat from the user body to a natural surface depends on the thermal property of the material. If the surface material type is known, these systems can use a material-specific pressure classifier to improve the detection accuracy. In this work, we address to solve this problem as we propose a novel approach that can detect material type from a user’s thermal finger impression on a surface. Our technique requires the user to touch a surface with a finger for 2 s. The recorded heat dissipation time series of the thermal finger impression is then analyzed in a classification framework for material identification. We studied the interaction of 15 users on 7 different material types, and our algorithm is able to achieve 74.65% material classification accuracy on the test data in a user-independent manner.
DOI:
10.1109/mmsp.2018.8547052
发表时间:
2018
期刊:
2018 IEEE 20th International Workshop on Multimedia Signal Processing (MMSP
影响因子:
--
作者:
Dunn, Tim;Banerjee, Sean;Banerjee, Natasha Kholgade
通讯作者:
Banerjee, Natasha Kholgade
DOI:
--
发表时间:
2017
期刊:
IEEE International Workshop/Symposium on Haptic, Audio and Visual Environments and Games
影响因子:
--
作者:
Tamás Aujeszky;Georgios Korres;M. Eid
通讯作者:
M. Eid