Evaluation of micromilled metal mold masters for the replication of microchip electrophoresis devices
Evaluation of micromilled metal mold masters for the replication of microchip electrophoresis devices
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DOI：
10.1007/s10404-006-0091-x
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发表时间：
2007-02-01
影响因子：
2.8
通讯作者：
Soper, Steven A.
中科院分区：
文献类型：
--
作者：
Hupert, Mateusz L.;Guy, W. Jason;Soper, Steven A.
高精度微铣削被评估为一种工具，用于快速制造模具母模，用于在热塑性塑料中复制微芯片器件。作为一个例子，微芯片电泳装置热压在聚（甲基丙烯酸甲酯）（PMMA）从黄铜主通过微铣削制造。具体而言，侧壁粗糙度和铣削拓扑结构的限制进行了研究。进行数值模拟以确定注入塞上存在的附加体积的影响（即，形状、尺寸、浓度分布）。对于曲率半径与通道宽度之比小于0.5的注射十字形件，塞的伸长并不显著（< 20%）。使用更强的捏电位，相比尖角注射器，是必要的，以获得短的样品塞。聚合物微结构的侧壁的特征在于由115 nm的最大平均粗糙度和290 nm的平均峰高。侧壁粗糙度对体微通道的影响不显著，因为与LiGA制备的具有ca值的装置相比，具有不同纵横比的PMMA微通道的侧壁粗糙度在统计学上是相同的。3.7 x 10（-4）cm（2）/（V S）。用PMMA微芯片电泳装置分离pUC 19 Sau 3AI双链DNA。在基于微研磨的芯片中实现的塔板数超过1百万/m2，并且与类似几何形状的LiGA制备的装置获得的塔板数相当。
High-precision micromilling was assessed as a tool for the rapid fabrication of mold masters for replicating microchip devices in thermoplastics. As an example, microchip electrophoresis devices were hot embossed in poly(methylmethacrylate) (PMMA) from brass masters fabricated via micromilling. Specifically, sidewall roughness and milling topology limitations were investigated. Numerical simulations were performed to determine the effects of additional volumes present on injection plugs (i.e., shape, size, concentration profiles) due to curvature of the corners produced by micromilling. Elongation of the plug was not dramatic (< 20%) for injection crosses with radii of curvatures to channel width ratios less than 0.5. Use of stronger pinching potentials, as compared to sharp-corner injectors, were necessary in order to obtain short sample plugs. The sidewalls of the polymer microstructures were characterized by a maximum average roughness of 115 nm and mean peak height of 290 nm. Sidewall roughness had insignificant effects on the bulk EOF as it was statistically the same for PMMA microchannels with different aspect ratios compared to LiGA-prepared devices with a value of ca. 3.7 x 10(-4) cm(2)/(V S). PMMA microchip electrophoresis devices were used for the separation of pUC19 Sau3AI double-stranded DNA. The plate numbers achieved in the micromilled-based chips exceeded I million/m and were comparable to the plate numbers obtained for the LiGA-prepared devices of similar geometry.