Silica-coating of metallic copper nanoparticles in aqueous solution
Silica-coating of metallic copper nanoparticles in aqueous solution
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DOI：
10.1016/j.colsurfa.2007.11.009
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发表时间：
2008-03
期刊：
影响因子：
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通讯作者：
Yoshio Kobayashi;T. Sakuraba
中科院分区：
文献类型：
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作者：
Yoshio Kobayashi;T. Sakuraba
本文介绍了一种在水溶液中对金属铜纳米粒子进行二氧化硅包覆的方法。由CuCl 2（0.001M）、还原剂肼（0.1M）和稳定剂柠檬酸（0.005M）和十六烷基三甲基溴化铵（0.0005M）在空气中的水中制备Cu纳米颗粒的胶体溶液。在铜纳米颗粒胶体的存在下，在含有硅烷偶联剂（3-氨丙基）三甲氧基硅烷（0.0001 M）和二氧化硅源硅酸钠溶液（0.144 M）的水溶液中进行二氧化硅涂覆。紫外-可见吸收光谱、透射电镜和X射线衍射分析表明，金属铜纳米粒子的粒径为51.2±23.6nm，表面包覆有二氧化硅。
This paper describes a method for silica-coating of metallic Cu nanoparticles in aqueous solution. Colloid solution of Cu nanoparticles was prepared from CuCl2(0.001M), a reducing reagent, hydrazine (0.1M), and stabilizers, citric acid (0.005M) and cetyltrimethylammonium bromide (0.0005M), in water in air. The silica-coating was performed in aqueous solution with a silane coupling agent, (3-aminopropyl)trimethoxysilane (0.0001M), and a silica source, sodium silicate solution (0.144M), in the presence of the Cu nanoparticle colloid. UV–vis absorption measurements, TEM observation and X-ray diffraction measurements revealed that the metallic Cu nanoparticles with a size of 51.2±23.6nm were coated with silica.