Selective electroless copper deposition on self-assembled dithiol monolayers.
Selective electroless copper deposition on self-assembled dithiol monolayers.
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DOI：
10.1021/am8001346
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发表时间：
2009-02
影响因子：
9.5
通讯作者：
D. Aldakov;Y. Bonnassieux;B. Geffroy;S. Palacin
中科院分区：
文献类型：
--
作者：
D. Aldakov;Y. Bonnassieux;B. Geffroy;S. Palacin
The paper reports the use of self-assembled monolayers (SAMs) of dithiols to induce electroless copper deposition on a gold substrate. The metallization catalyst, palladium nanoparticles, is bound on the dithiol SAM. The assembly process is followed by IR and X-ray photoelectron spectroscopies to confirm the formation of a monolayer with bound catalyst. Electroless metallization is then carried out with a steady deposition rate of 130 nm/min. Additionally, microcontact printing of the catalyst on the SAM by poly(dimethylsiloxane) stamps is used to localize copper deposits. Resulting metallization is selective and allows for a high resolution.
