Friction Technique for Optimum Thermocompression Bonds
Friction Technique for Optimum Thermocompression Bonds
复制标题
最佳热压粘合的摩擦技术
DOI：
--
复制
发表时间：
1964
期刊：
影响因子：
--
通讯作者：
W. Antle
中科院分区：
文献类型：
--
作者：
W. Antle
热压引线键合在半导体或薄膜电子器件上的成功应用取决于相关参数的建立。热压粘结的质量主要与工艺温度和粘结力有关。提出了一种利用摩擦系数的方法，既减少了确定最佳参数值所需的时间，又提高了结果的准确性。摩擦过程的现代理论被用来根据摩擦测量发展剪切和拉伸粘结强度的数学表达式。参数测定技术的进一步应用涉及到可能影响热压粘合的表面污染的测量。
The successful application of thermocompression lead bonding to semiconductor or thin-film electronic devices depends on the establishment of the associated parameters. The quality of a thermocompression bond is primarily related to the process temperature and bonding force. A technique using the coefficient of friction is presented that both reduces the time necessary for determining optimum parameter values and increases the accuracy of the results. Modem theories of the friction process are used to develop mathematical expressions for shear and tensile bond strengths in terms of friction measurements. A further application of the parameter determination technique concerns the measurement of surface contamination that may affect thermocompression bonding.