Scalable monolayer-functionalized nanointerface for thermal conductivity enhancement in copper/diamond composite
Scalable monolayer-functionalized nanointerface for thermal conductivity enhancement in copper/diamond composite
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DOI：
10.1016/j.carbon.2021.01.018
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发表时间：
2021-01
期刊：
影响因子：
10.9
通讯作者：
Bin Xu;S. Hung;Shiqian Hu;Cheng Shao;Rulei Guo;Junho Choi;T. Kodama;Fu-Rong Chen;J. Shiomi
中科院分区：
文献类型：
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作者：
Bin Xu;S. Hung;Shiqian Hu;Cheng Shao;Rulei Guo;Junho Choi;T. Kodama;Fu-Rong Chen;J. Shiomi
为了开发高导热铜/金刚石复合材料，采用在铜/金刚石复合材料高温烧结前应用自组装单层（SAM）的非常规方法提高铜与金刚石之间的热边界导率（TBC）。通过详细的SAM形态表征和TBC测量，首先在模型界面系统上系统地证实了这种增强。TBC显著依赖于SAM的覆盖范围和排序，高质量SAM的形成将TBC从27 MW/m2-K提高到73 MW/m2-K，这是没有SAM的值。通过分子动力学模拟，确定了TBC增强是由SAM桥的数目和态的振动密度重叠决定的。在模型体系中TBC最高的条件下，用SAM同时对粒径为210 μm的金刚石颗粒进行功能化，并与铜一起烧结制备体积分数为50%的各向同性铜/金刚石复合材料。室温下测得的热导率为711 W/m-K，是相似金刚石颗粒体积分数和尺寸的样品中最高的。这项工作展示了一种通过SAM功能化来提高复合材料导热性的新策略。
Aiming at developing high thermal conductivity copper/diamond composite, an unconventional approach applying self-assembled monolayer (SAM) prior to the high-temperature sintering of copper/diamond composite was utilized to enhance the thermal boundary conductance (TBC) between copper and diamond. The enhancement was first systematically confirmed on a model interface system by detailed SAM morphology characterization and TBC measurements. TBC significantly depends on the SAM coverage and ordering, and the formation of high-quality SAM promoted the TBC to 73 MW/m2-K from 27 MW/m2-K, the value without SAM. With the help of molecular dynamics simulations, the TBC enhancement was identified to be determined by the number of SAM bridges and the overlap of vibrational density of states. The diamond particles of 210 μm in size were simultaneously functionalized by SAM with the condition giving the highest TBC in the model system and sintered together with the copper to fabricate isotropic copper/diamond composite of 50% volume fraction. The measured thermal conductivity marked 711 W/m-K at room temperature, the highest value among the ones with similar diamond-particles volume fraction and size. This work demonstrates a novel strategy to enhance the thermal conductivity of composite materials by SAM functionalization.