Laboratory investigation of microelectronics-based stimulators for large-scale suprachoroidal transretinal stimulation (STS)
Laboratory investigation of microelectronics-based stimulators for large-scale suprachoroidal transretinal stimulation (STS)
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DOI：
10.1088/1741-2560/4/1/s10
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发表时间：
2007-03-01
影响因子：
4
通讯作者：
Tano, Y.
中科院分区：
文献类型：
--
作者：
Ohta, J.;Tokuda, T.;Tano, Y.
本文描述了实现具有大量刺激电极的可靠且可重复的微芯片刺激器的技术发展。本文提出了一种具有500多个电极的基于微芯片的脉络膜上经视网膜刺激器，并给出了一个实例。为了提高这种大型阵列的可靠性和可重复性，我们引入了一种倒装芯片键合技术，并将微芯片放置在衬底的背面。采用0.35 μ m标准CMOS工艺技术制备了600 μ m方形微芯片。12个微芯片通过一个凸起在聚酰亚胺衬底上倒装结合。为了评估该装置的可行性，我们成功地制造了一个包含12个微芯片和118个Pt/Au凸点电极的刺激器，并在盐水溶液中演示了它们的操作2周。此外，为了评估该装置在体内的运行情况，将带有一个活性IrOx电极的刺激器植入家兔的巩膜袋，获得阈值为100 μ a的诱发电位（EEP）信号。我们还制作了一个具有64个微芯片的模拟器，该模拟器具有576个电极（微芯片中的9个电极乘以64个微芯片）。
This paper describes the technological developments underlying the realization of a reliable and reproducible microchip-based stimulator with a large number of stimulus electrodes. A microchip-based stimulator with over 500 electrodes for suprachoroidal transretinal stimulation (STS) is proposed in this paper, and an example is presented. To enhance reliability and reproducibility for such a large array, we introduce a flip-chip bonding technique and place microchips on the reverse side of a substrate. A square microchip of size 600 mu m was fabricated using 0.35 mu m standard CMOS process technology. Twelve microchips were flip-chip bonded on a polyimide substrate through An bumps. To evaluate the feasibility of the proposed device, we successfully fabricated a stimulator with 12 microchips and 118 electrodes made of Pt/Au bumps, and demonstrated their operation in a saline solution for 2 weeks. Also, to evaluate the device operation in vivo, a stimulator with one active IrOx electrode was implanted into the scleral pocket of a rabbit and electrical evoked potential (EEP) signals with a threshold of 100 mu A were obtained. We also fabricated a simulator with 64 microchips that has 576 electrodes (9 electrodes in a microchip times 64 microchips).