Influence of Application Time and Etching Mode of Universal Adhesives on Enamel Adhesion
Influence of Application Time and Etching Mode of Universal Adhesives on Enamel Adhesion
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DOI：
10.3290/j.jad.a39913
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发表时间：
2018-01-01
影响因子：
3.3
通讯作者：
Miyazaki, Masashi
中科院分区：
文献类型：
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作者：
Sai, Keiichi;Takamizawa, Toshiki;Miyazaki, Masashi
目的：探讨通用胶粘剂的使用时间和蚀刻方式对牙釉质附着力的影响。材料和方法：使用五种通用胶粘剂：adese universal， Bondmer Lightless, Clearfil universal Bond Quick， G-Premio Bond和Scotchbond universal。准备牛门牙，分为四组，每组10颗牙。测定SBS、Ra、SFE的方法如下：1。自腐蚀模式，应用后立即吹气（IA）；2. 自蚀刻模式，延长应用时间（PA）；3. 蚀刻和冲洗模式与IA；4. 带有PA的蚀刻和冲洗模式。储水24 h后，对粘结组件进行剪切粘结强度（SBS）试验。对于表面粗糙度（Ra）和表面自由能（SFE）的测量，在进行测量之前，只需将粘合剂涂在牙釉质上并用丙酮和水冲洗。结果：无论应用时间或粘合剂类型如何，蚀刻-漂洗模式的SBS和Ra值均显著高于自蚀刻模式。尽管在自蚀刻模式下，大多数粘合剂的SFE值随着使用时间的增加而降低，但在蚀刻-漂洗模式下，SFE值取决于粘合剂类型和使用时间。结论：蚀刻方式、时间、胶粘剂类型对SBS、Ra、SFE值有显著影响。
Purpose: To investigate the influence of application time and etching mode of universal adhesives on enamel adhesion.Materials and Methods: Five universal adhesives, Adhese Universal, Bondmer Lightless, Clearfil Universal Bond Quick, G-Premio Bond, and Scotchbond Universal, were used. Bovine incisors were prepared and divided into four groups of ten teeth each. SBS, Ra, and SFE were determined after the following procedures: 1. self-etch mode with immediate air blowing after application (IA); 2. self-etch mode with prolonged application time (PA); 3. etch-and-rinse mode with IA; 4. etch-and-rinse mode with PA. After 24-h water storage, the bonded assemblies were subjected to shear bond strength (SBS) tests. For surface roughness (Ra) and surface free energy (SFE) measurements, the adhesives were simply applied to the enamel and rinsed with acetone and water before the measurements were carried out.Results: Significantly higher SBS and Ra values were obtained with etch-and-rinse mode than with self-etch mode regardless of the application time or type of adhesive. Although most adhesives showed decreased SFE values with increased application time in self-etch mode, SFE values in etch-and-rinse mode were dependent on the adhesive type and application time.Conclusions: Etching mode, application time, and type of adhesive significantly influenced the SBS, Ra, and SFE values.