Research on High-Reliable Low-Loss HTCC Technology Applied in Millimeter Wave SMT Package
Research on High-Reliable Low-Loss HTCC Technology Applied in Millimeter Wave SMT Package
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DOI：
10.1007/978-3-319-51697-4_6
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发表时间：
2017
期刊：
影响因子：
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通讯作者：
Pang Xueman
中科院分区：
文献类型：
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作者：
Pang Xueman
本章讨论了高可靠低损耗HTCC技术的组成和技术。低损耗陶瓷是由Al2O3粉末和一些添加剂如MgO、SiO2、Cr2O3、MoO3等制备而成。将添加剂在溶液中沉积在Al2O3粉体上，均匀包裹Al2O3粉体表面，制成复合粉体。采用二次烧结技术制备致密陶瓷，确保致密化和完美的微观结构。测量了低损耗陶瓷样品的弯曲强度、相组成、微观形貌和介电损耗。陶瓷的介电损耗为(8.0–10.0)×10−4。本章研究了高温共烧钨导体浆料的制备工艺，并分析了钨粉微观结构和分布、浆料中非金属含量、金属化结合强度和浆料方块电阻的影响。钨膏片电阻为6mΩ/□；与氧化铝共烧陶瓷基体的金属化结合强度为54Mpa。该钨浆料可用于厚膜集成电路工艺上100μm线宽的细线印刷。钨膏应用于微波和毫米波封装的绝缘体上，作为连接壳体内器件和壳体外模块的导体材料。对采用高可靠低损耗HTCC技术制备的SMT封装进行微波测试结果表明，单射频信号传输通道在8mm频率范围内的插入损耗小于0.8dB，回波损耗大于10dB，隔离度大于20dB。该研究工作支持了低损耗陶瓷在微波和毫米波介质中的应用。
The compositions and technology for high-reliable low-loss HTCC technology were discussed in this chapter. Low-loss ceramic was prepared by Al2O3powder and some additives, MgO, SiO2, Cr2O3, MoO3, for example. The additives were deposited on Al2O3powder in liquid solution, enwrapping the surface of Al2O3powder uniformly to make composite powder. The compact ceramic was prepared by two-sinter technology to ensure densification and perfect microstructure. Bending strength, phase composition, micro-morphology, and dielectric loss of the low-loss ceramic sample were measurement. The dielectric loss of the ceramic is (8.0–10.0)×10−4. Techniques of manufacturing high temperature co-fired tungsten conductor pastes were researched in this chapter, and also the effects of microstructure and distribution of tungsten powders, the content of nonmetallic in slurry, metallization combination strength, and sheet resistance of the paste were analyzed. The resistance of tungsten paste sheet is 6 mΩ/□; the metallization combination strength to alumina co-fire ceramic substrate is 54 Mpa. This tungsten slurry can be used in fine line printing of 100 μm line wide on thick film integrated circuits process. Tungsten paste was applied on insulator of microwave and millimeter wave package as conductor material connected the devices in the shell and the module out of the shell. The result of microwave test on the SMT package prepared by the high-reliable low-loss HTCC technology showed that the insert loss of single RF signal transmission channel in 8 mm frequency range was less than 0.8 dB, the return loss was larger than 10 dB and the isolation was larger than 20 dB. This research work supported the application of low-loss ceramic in microwave and millimeter-wave medium.