Ag-Sn-Hg alloys as electron compounds.
Ag-Sn-Hg alloys as electron compounds.
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Ag-Sn-Hg 合金作为电子化合物。
DOI：
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发表时间：
1970
期刊：
影响因子：
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通讯作者：
L. B. Johnson
中科院分区：
文献类型：
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作者：
L. B. Johnson
牙科银汞合金γ1相的非凡稳定性被认为表明牙科银汞合金中的部分锡包含在该相中。将Hume-Rothery的“电子化合物”概念推广到Ag-Sn-Hg三元系，估算了Sn在γ1结构中的含量。
制备含9.1重量% Sn的Ag-Sn合金，球化，并分级。部分合并并模塑成拉伸试样，其中部分进行X射线衍射，腐蚀试验，并进行测试，以确定合并率和尺寸变化，在设置。
X射线衍射图显示完全不存在γ2相（因此表明所有Sn都在γ1相中），并且在牙科汞合金的γ Ag-Hg和γ1相之间存在稳定的中间体。物理试验表明，汞齐化率低，1小时强度低，7天强度高，耐腐蚀性高。
The extraordinary stability of the γ1 phase of dental amalgam was believed to indicate that part of the Sn in dental amalgam was contained in this phase. By extending the Hume-Rothery “electron compound” ideas to the three component Ag-Sn-Hg system, an estimate was made of the amount of Sn which could be held in the γ1 structure.
A Ag-Sn alloy containing 9.1 weight per cent Sn was prepared, spheroidized, and sized. Portions were amalgamated and molded into tensile specimens, parts of which were subjected to X-ray diffraction, corrosion tests, and tests to determine amalgamation rate and dimensional changes during setting.
X-ray diffraction patterns showed a complete absence of the γ2 phase, (thus indicating that all Sn was in the γ1 phase) and a stability intermediate between γ Ag-Hg and the γ1 phase of dental amalgam. Physical tests showed a low amalgamation rate, low 1-hr strength, high 7-day strength, and high corrosion resistance.