Effect of trace Al on growth rates of intermetallic compound layers between Sn-based solders and Cu substrate
Effect of trace Al on growth rates of intermetallic compound layers between Sn-based solders and Cu substrate
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DOI：
10.1016/j.jallcom.2012.08.023
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发表时间：
2012-12
影响因子：
6.2
通讯作者：
Jianfeng Li;P. Agyakwa;C. M. Johnson
中科院分区：
文献类型：
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作者：
Jianfeng Li;P. Agyakwa;C. M. Johnson
本文研究了在100锡、96.5锡-3.5银(SA)和95.5锡-3.8Ag-0.7铜(SAC)焊料中添加1wt%Al对焊料与铜衬底之间金属间化合物(IMC)层生长速度的影响。在260°C、2%H_298%N_2形成气体下回流5-120分钟的过程中，观察到SAC-1Al/Cu体系中IMC生长的最显著的减慢。这伴随着η2(AlCu2)金属间化合物层的演化，它首先在焊料体内形成，然后在焊料/铜界面向先前形成的η(Cu6Sn5)和ε(Cu3Sn5)IMC迁移并逐渐取代，最后转变为δ(Al2Cu3)IMC并再次弥散到焊料中。在170℃空气中热老化24-2096h的SAC-1Al/Cu样品中，观察到类似的IMC生长和相关演化的减少。
This paper reports the effect of the addition of 1wt% Al into 100Sn, 96.5Sn–3.5Ag (SA) and 95.5Sn–3.8Ag–0.7Cu (SAC) solders, on growth rates of intermetallic compound (IMC) layers between the solders and a Cu substrate. During reflow at 260°C under 2%H298%N2forming gas for 5–120min, the most pronounced reduction in IMC growth was observed in the SAC–1Al/Cu system. This was accompanied with the evolution of a layer of η2(AlCu) IMC which was first formed within the bulk of the solder, then migrated towards and gradually replaced the previously formed η (Cu6Sn5) and ε (Cu3Sn) IMCs at the solder/Cu interface, and was finally transformed into δ (Al2Cu3) IMC and dispersed into the bulk of the solder again. A similar reduction in growth and associated evolution of IMCs was observed in the SAC–1Al/Cu samples subjected to thermal ageing at 170°C under air for 24–2096h.