Thermal expansion of Cu/carbon nanotube composite wires and the effect of Cu-spatial distribution
Thermal expansion of Cu/carbon nanotube composite wires and the effect of Cu-spatial distribution
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DOI：
10.1016/j.jmrt.2020.03.094
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发表时间：
2020-05
期刊：
影响因子：
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通讯作者：
R. Sundaram;Takeo Yamada;K. Hata;A. Sekiguchi
中科院分区：
文献类型：
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作者：
R. Sundaram;Takeo Yamada;K. Hata;A. Sekiguchi
我们首次报道了铜/碳纳米管（Cu/CNT）宏观线复合材料的热膨胀系数（CTE）及其对CNT-Cu混合的强烈依赖性。具有40体积%纳米管均匀混合在连续Cu基体中的均匀复合线显示CTE为4.42 × 10−6°C-1（约26% Cu-CTE，与Si-CTE相似）。该值与Turner的模型预测相匹配，这意味着当纳米管-Cu共享接触高时，CNT的低热膨胀和高体积模量都有助于抵消Cu热膨胀。相反，不存在或不均匀的CNT-Cu混合，即，减少的共享界面导致更高的线复合材料CTE（1053 - 92% Cu-CTE），即使具有更高的CNT体积%。
We report for the first time the coefficient of thermal expansion (CTE) of Cu/carbon nanotube (Cu/CNT) macroscopic wire composites and its strong dependence on CNT-Cu mixing. Homogeneous composite wires with 40 vol% nanotubes uniformly mixed in continuous Cu matrix showed CTE ∼4.42 × 10−6°C-1(∼26% Cu-CTE and similar to Si-CTE). The value matches with Turner’s model predictions implying that when nanotube-Cu shared contact is high, both low thermal expansion and high bulk modulus of CNTs contribute to offsetting Cu thermal expansion. In contrast, absence of or non-uniform CNT-Cu mixing i.e., reduced shared interface led to higher wire-composite CTEs (∼53−92% Cu-CTE) even with higher CNT vol%.