Development of a Hydrostatic Bearing in High Vacuum Using an Ionic Liquid for a Semiconductor Fabrication Device
Development of a Hydrostatic Bearing in High Vacuum Using an Ionic Liquid for a Semiconductor Fabrication Device
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DOI：
10.4028/p-nsw1co
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发表时间：
2024-02
期刊：
影响因子：
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通讯作者：
Takao Okabe;Kei Somaya
中科院分区：
文献类型：
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作者：
Takao Okabe;Kei Somaya
使用离子液体 (IL) 的静压轴承已被开发出来，用于在高真空室中浮动半导体晶圆。在半导体制造中，抑制晶圆过热并保持恒定的温度分布非常重要。该方法旨在通过从晶圆背面提供 IL 使其浮动，从而实现均匀的温度分布，从而无需机械接触。然而，由于没有在高真空环境中使用IL通过静压轴承悬浮晶片的例子，因此本研究研究了循环IL对真空条件（例如真空压力和排气）的影响。实验结果表明，即使在100 ml IL循环时，所开发的原型机也能够维持稳定的10-5 Pa超高真空，并提供足够的压力使晶圆悬浮。
A hydrostatic bearing using ionic liquid (IL) has been developed to float semiconductor wafers in a high vacuum chamber. In semiconductor manufacturing, it is important to suppress overheating of wafers and maintain a constant temperature distribution. This method aims to achieve uniform temperature distribution by supplying IL from the backside of the wafer to float it, thereby without mechanical contact. However, since there are no examples of wafers levitated by hydrostatic bearings using IL in a high-vacuum environment, the effect of circulating IL to the vacuum conditions such as vacuum pressure and outgassing were investigated in this study. Experimental results showed that the developed prototype machine was capable of maintaining a stable ultrahigh-vacuum of 10-5 Pa and supplying sufficient pressure to levitate wafers even when 100 ml of IL was circulated.