Evaluation of microstructure and contiguity of W/Cu composites prepared by coated tungsten powders
Evaluation of microstructure and contiguity of W/Cu composites prepared by coated tungsten powders
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DOI：
10.1016/j.ijrmhm.2008.12.008
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发表时间：
2009-07-01
影响因子：
3.6
通讯作者：
Parvin, N.
中科院分区：
文献类型：
--
作者：
Amirjan, M.;Zangeneh-Madar, K.;Parvin, N.
本文研究了包覆钨粉制备的W/Cu复合压坯的浸渗行为。采用化学镀技术在钨颗粒表面包覆Ni、Ni-P和Ni-Cu-P。然后在选择性压力下压实涂覆的钨粉，以控制10-20重量%范围内的渗透铜。渗透过程在还原气氛下在1300 ℃下进行。采用OM/SEM、EDS和Archimedes等方法研究了预镀钨颗粒对W/Cu复合材料渗压坯的显微组织、致密性和致密度的影响，结果表明，预镀钨颗粒使渗压坯的显微组织更加均匀，相对致密度达到99.3%。Ni-Cu-P包覆钨粉制备的复合材料中钨钨颗粒的结合度较低。(C)2008爱思唯尔有限公司保留所有权利。
In this paper, infiltration behavior Of W/Cu Composite compacts made from coated tungsten powder has been investigated. For this purpose, tungsten particles were coated with Ni, Ni-P and Ni-Cu-P using electroless plating technique. Then the coated tungsten powders were compacted under selective pressures for control infiltrated copper in range 10-20 wt%. Infiltration process was carried out at 1300 degrees C under a reducing atmosphere. The effect of pre-coat of tungsten particles on microstructure, contiguity and density of infiltrated W/Cu compacts was evaluated by OM/SEM, EDS and Archimedes methods.It was found that electroless plating of tungsten particles leads to more homogeneity microstructure so relative density of 99.3% was achieved for infiltrated compacts. The contiguity of W-W particles in the microstructure of composite made from Ni-Cu-P coated tungsten powder was lower than to other ones. (C) 2008 Elsevier Ltd. All rights reserved.